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dc.contributor.authorChen, Chih-Yangen_US
dc.contributor.authorMa, Ming-Wenen_US
dc.contributor.authorChen, Wei-Chengen_US
dc.contributor.authorLin, Hsiao-Yien_US
dc.contributor.authorYeh, Kuan-Linen_US
dc.contributor.authorWang, Shen-Deen_US
dc.contributor.authorLei, Tan-Fuen_US
dc.date.accessioned2014-12-08T15:12:39Z-
dc.date.available2014-12-08T15:12:39Z-
dc.date.issued2008-02-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2007.914083en_US
dc.identifier.urihttp://hdl.handle.net/11536/9719-
dc.description.abstractNegative bias temperature instability (NBTI) degradation mechanism in body-tied low-temperature polycrystalline silicon thin-film transistors (LTPS TFTs) is analyzed by the charge-pumping (CP) technique. The properties of bulk trap states (including interface and grain boundary trap states) are directly characterized from the CP current. The increase of the fixed oxide charges is also extracted, which has not been quantified in previous studies of NBTI degradation in LTPS TFTs. The experimental results confirm that the NBTI degradation in LTPS TFTs is caused by the generation of bulk trap states and oxide trap states.en_US
dc.language.isoen_USen_US
dc.subjectcharge-pumping (CP) techniqueen_US
dc.subjectlow-temperature polycrystalline silicon thin-film transistors (LTPSen_US
dc.subjectTFTs)en_US
dc.subjectnegative bias temperature instability (NBTI)en_US
dc.titleAnalysis of negative bias temperature instability in body-tied low-temperature polycrystalline silicon thin-film transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2007.914083en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume29en_US
dc.citation.issue2en_US
dc.citation.spage165en_US
dc.citation.epage167en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000252622800010-
dc.citation.woscount7-
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