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dc.contributor.authorLee, C. E.en_US
dc.contributor.authorLee, Y. C.en_US
dc.contributor.authorKuo, H. C.en_US
dc.contributor.authorTsai, M. R.en_US
dc.contributor.authorLu, T. C.en_US
dc.contributor.authorCwang, S.en_US
dc.date.accessioned2014-12-08T15:12:39Z-
dc.date.available2014-12-08T15:12:39Z-
dc.date.issued2008-02-01en_US
dc.identifier.issn0268-1242en_US
dc.identifier.urihttp://dx.doi.org/10.1088/0268-1242/23/2/025015en_US
dc.identifier.urihttp://hdl.handle.net/11536/9724-
dc.description.abstractGaN-based flip-chip LEDs (FC-LEDs) with geometric sapphire shaping structure were fabricated. The sapphire shaping structure was formed on the bottom side of the sapphire substrate by the chemical wet etching technique for the purpose of light extraction. The crystallography-etched facets were `(1 0 1 0) M-plane, (1 1 0 2) R-plane and (1 1 2 0) A-plane against the (0 0 0 1) c-axis with the angles range between similar to 29 degrees and similar to 60 degrees. It is demonstrated that the geometrical shape of the sapphire windows layer improves the light extraction efficiency. Compared to the conventional FC-LED, the sapphire-shaped FC-LED significantly enhanced the output power. The light output power of sapphire-shaped FC-LEDs was increased by 55% (at 350 mA current injection) compared to that of conventional FC-LEDs.en_US
dc.language.isoen_USen_US
dc.titleHigh brightness GaN-based flip-chip light-emitting diodes by adopting geometric sapphire shaping structureen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/0268-1242/23/2/025015en_US
dc.identifier.journalSEMICONDUCTOR SCIENCE AND TECHNOLOGYen_US
dc.citation.volume23en_US
dc.citation.issue2en_US
dc.citation.epageen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000253279800015-
dc.citation.woscount4-
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