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dc.contributor.author陳智en_US
dc.contributor.authorChen Chihen_US
dc.date.accessioned2014-12-13T10:42:09Z-
dc.date.available2014-12-13T10:42:09Z-
dc.date.issued2011en_US
dc.identifier.govdocNSC98-2221-E009-036-MY3zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/98978-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=2205557&docId=351852en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.title鋁導線的設計對覆晶銲錫電遷移的影響zh_TW
dc.titleEffect of Al-Trace Design on the Electromigration of Flip-Chip Solder Joints.en_US
dc.typePlanen_US
dc.contributor.department國立交通大學材料科學與工程學系(所)zh_TW
Appears in Collections:Research Plans