鋁導線的設計對覆晶銲錫電遷移的影響

Full metadata record

DC Field	Value	Language
dc.contributor.author	陳智	en_US
dc.contributor.author	Chen Chih	en_US
dc.date.accessioned	2014-12-13T10:42:09Z	-
dc.date.available	2014-12-13T10:42:09Z	-
dc.date.issued	2011	en_US
dc.identifier.govdoc	NSC98-2221-E009-036-MY3	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/98978	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=2205557&docId=351852	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	鋁導線的設計對覆晶銲錫電遷移的影響	zh_TW
dc.title	Effect of Al-Trace Design on the Electromigration of Flip-Chip Solder Joints.	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學材料科學與工程學系（所）	zh_TW
Appears in Collections:	Research Plans