| 標題: | 鋁導線的設計對覆晶銲錫電遷移的影響 Effect of Al-Trace Design on the Electromigration of Flip-Chip Solder Joints. |
| 作者: | 陳智 Chen Chih 國立交通大學材料科學與工程學系（所） |
| 公開日期: | 2011 |
| 官方說明文件#: | NSC98-2221-E009-036-MY3 |
| URI: | http://hdl.handle.net/11536/98978 https://www.grb.gov.tw/search/planDetail?id=2205557&docId=351852 |
| Appears in Collections: | Research Plans |
- 鋁導線的設計對覆晶銲錫電遷移的影響 / 陳智;Chen Chih
- 鋁導線的設計對覆晶銲錫電遷移的影響 / 陳智;Chen Chih
- Effect of al trace dimension on electromigration failure time of flip-chip solder joints / Chiu, S. H.;Chen, Chih;Yao, D. J.
- Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints / Liang, S. W.;Hsiao, H. Y.;Chen, Chih
- Temperature and current-density distributions in flip-chip solder joints with Cu traces / Hsu, CY;Yao, DJ;Liang, SW;Chen, C;Yeh, ECC
- Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints / Chang, Y. W.;Chiu, S. H.;Chen, Chih
Loading...