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dc.contributor.authorHuang, Hsin-Hsiungen_US
dc.contributor.authorWu, Pei-Lunen_US
dc.contributor.authorZeng, Hung-Yuen_US
dc.contributor.authorLiu, Po-Chunen_US
dc.contributor.authorChi, Tung-Weien_US
dc.contributor.authorTsay, Jenq-Daren_US
dc.contributor.authorLeea, Wei-Ien_US
dc.date.accessioned2014-12-08T15:12:50Z-
dc.date.available2014-12-08T15:12:50Z-
dc.date.issued2008en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/9897-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2913151en_US
dc.description.abstractExtended microtunnels with triangular cross sections in thick GaN films were demonstrated using wet chemical etching on specially designed epitaxial lateral overgrowth structures. For tunnels along the < 1 (1) over bar 00 > and < 11 (2) over bar0 > directions of GaN, the {11 (22) over bar} and {10 (11) over bar} facets are the etch stop planes with activation energies of 23 kcal/mol determined by wet chemical etching. The axial etching rate of the tunnels in the < 1 (1) over bar 00 > direction is twice as large than that along the < 11 (2) over bar0 > direction. The highest etching rate of the tunnels in the axial direction is 1000 mu m/h. (C) 2008 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleTriangular extended microtunnels in GaN prepared by selective crystallographic wet chemical etchingen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2913151en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume155en_US
dc.citation.issue7en_US
dc.citation.spageH504en_US
dc.citation.epageH507en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000256198900059-
dc.citation.woscount4-
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