針對3D整合之電子設計自動化技術開發---子計畫二：三維電路整合之實體設計系統(II)

Full metadata record

DC Field	Value	Language
dc.contributor.author	李毅郎	en_US
dc.contributor.author	Li Yih-Lang	en_US
dc.date.accessioned	2014-12-13T10:43:32Z	-
dc.date.available	2014-12-13T10:43:32Z	-
dc.date.issued	2010	en_US
dc.identifier.govdoc	NSC99-2220-E009-036	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/99796	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=2159206&docId=347505	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	信號矽穿孔	zh_TW
dc.subject	廣域繞線	zh_TW
dc.subject	三維積體電路	zh_TW
dc.subject	Signal Through-Silicon-Vias	en_US
dc.subject	Global Routing	en_US
dc.subject	3D IC	en_US
dc.title	針對3D整合之電子設計自動化技術開發---子計畫二：三維電路整合之實體設計系統(II)	zh_TW
dc.title	Physical Design in 3D IC Integration (II)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學資訊工程學系（所）	zh_TW
Appears in Collections:	Research Plans