完整後設資料紀錄
DC 欄位語言
dc.contributor.author李毅郎en_US
dc.contributor.authorLi Yih-Langen_US
dc.date.accessioned2014-12-13T10:43:32Z-
dc.date.available2014-12-13T10:43:32Z-
dc.date.issued2010en_US
dc.identifier.govdocNSC99-2220-E009-036zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/99796-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=2159206&docId=347505en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.subject信號矽穿孔zh_TW
dc.subject廣域繞線zh_TW
dc.subject三維積體電路zh_TW
dc.subjectSignal Through-Silicon-Viasen_US
dc.subjectGlobal Routingen_US
dc.subject3D ICen_US
dc.title針對3D整合之電子設計自動化技術開發---子計畫二:三維電路整合之實體設計系統(II)zh_TW
dc.titlePhysical Design in 3D IC Integration (II)en_US
dc.typePlanen_US
dc.contributor.department國立交通大學資訊工程學系(所)zh_TW
顯示於類別:研究計畫