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Title: 針對3D整合之電子設計自動化技術開發---子計畫二：三維電路整合之實體設計系統(II)
Physical Design in 3D IC Integration (II)
Authors: 李毅郎
Li Yih-Lang
國立交通大學資訊工程學系（所）
Keywords: 信號矽穿孔;廣域繞線;三維積體電路;Signal Through-Silicon-Vias;Global Routing;3D IC
Issue Date: 2010
Gov't Doc #: NSC99-2220-E009-036
URI: http://hdl.handle.net/11536/99796
https://www.grb.gov.tw/search/planDetail?id=2159206&docId=347505
Appears in Collections:Research Plans


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