A scalable noise de-embedding technique for on-wafer microwave device characterization

Abstract

In this letter, we present a scalable and efficient noise de-embedding procedure, which is based on transmission-line theory and cascade configurations, for on-wafer microwave measurements of silicon MOSFETs. The proposed de-embedding procedure utilizes one open and one thru dummy structures to eliminate the parasitic effects from the probe pads and the input/output interconnects of a device-under-test (DUT), respectively. This method can generate the scalable distributed interconnect parameters to efficiently and precisely remove the redundant parasitics of the DUTs with various device sizes and arbitrary interconnect dimensions.