Effect of al trace dimension on electromigration failure time of flip-chip solder joints

Abstract

The effect of Al-trace dimension on electromigration of flip-chip solder joints was investigated. The Al trace dimension was found to have a significant influence on the electromigration failure time. When joints with Al traces 100 mu m wide were stressed by 1.0 A at 100 degrees C, failure times were 35 h, 1,700 h, and > 3,000 h for joints with Al traces that were 2,550 mu m, 1,700 mu m, and 850 mu m long, respectively. Solder joints with Al traces 40 mu m wide and 2,550 mu m long failed instantly at 0.6 A. The Joule heating effect was found to be responsible for the huge difference in failure time.