Effect of al trace dimension on electromigration failure time of flip-chip solder joints
| dc.citation.epage | 1744 | en_US |
| dc.citation.issue | 9 | en_US |
| dc.citation.spage | 1740 | en_US |
| dc.citation.volume | 35 | en_US |
| dc.citation.woscount | 3 | |
| dc.contributor.author | Chiu, S. H. | en_US |
| dc.contributor.author | Chen, Chih | en_US |
| dc.contributor.author | Yao, D. J. | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:15:51Z | |
| dc.date.available | 2014-12-08T15:15:51Z | |
| dc.date.issued | 2006-09-01 | en_US |
| dc.description.abstract | The effect of Al-trace dimension on electromigration of flip-chip solder joints was investigated. The Al trace dimension was found to have a significant influence on the electromigration failure time. When joints with Al traces 100 mu m wide were stressed by 1.0 A at 100 degrees C, failure times were 35 h, 1,700 h, and > 3,000 h for joints with Al traces that were 2,550 mu m, 1,700 mu m, and 850 mu m long, respectively. Solder joints with Al traces 40 mu m wide and 2,550 mu m long failed instantly at 0.6 A. The Joule heating effect was found to be responsible for the huge difference in failure time. | en_US |
| dc.identifier.issn | 0361-5235 | en_US |
| dc.identifier.journal | JOURNAL OF ELECTRONIC MATERIALS | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/11832 | |
| dc.identifier.wosnumber | WOS:000240529900010 | |
| dc.language.iso | en_US | en_US |
| dc.subject | electromigration | en_US |
| dc.subject | flip chip | en_US |
| dc.subject | Joule heating | en_US |
| dc.title | Effect of al trace dimension on electromigration failure time of flip-chip solder joints | en_US |
| dc.type | Article | en_US |