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Performance improvement and scalability of nonoverlapped implantation nMOSFETs with charge-trapping spacers as nonvolatile memories

dc.citation.epage3307en_US
dc.citation.issue12en_US
dc.citation.spage3299en_US
dc.citation.volume54en_US
dc.citation.woscount5
dc.contributor.authorJeng, Erik S.en_US
dc.contributor.authorChiu, Chia-Sungen_US
dc.contributor.authorHon, Chih-Hsuehen_US
dc.contributor.authorKuo, Pai-Chunen_US
dc.contributor.authorFan, Chen-Chiaen_US
dc.contributor.authorHsieh, Chien-Shengen_US
dc.contributor.authorHsu, Hui-Chunen_US
dc.contributor.authorChen, Yuan-Fengen_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.date.accessioned2014-12-08T15:13:00Z
dc.date.available2014-12-08T15:13:00Z
dc.date.issued2007-12-01en_US
dc.description.abstractThis paper explores gate-to-source/drain nonoverlapped implantation (NOI) devices that function as nonvolatile memories (NVMs) by trapping charges in the silicon nitride spacers. These NOI nMOSFET devices with improved NVM characteristics were simulated and demonstrated. For a 0.8 V shift in the threshold voltage, the programming and erasing speeds of NOI devices are as fast as 40 and 60 mu s, respectively. Improvements of other related NVM characteristics, including charge retention and cycling endurance,, are reported. Finally, the scalability of NOI devices is simulated and discussed.en_US
dc.identifier.doi10.1109/TED.2007.908598en_US
dc.identifier.issn0018-9383en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2007.908598en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/10039
dc.identifier.wosnumberWOS:000251268300021
dc.language.isoen_USen_US
dc.subjectcharge trappingen_US
dc.subjectnonoverlapped implantation (NOI)en_US
dc.subjectnonvolatile memory (NVM)en_US
dc.titlePerformance improvement and scalability of nonoverlapped implantation nMOSFETs with charge-trapping spacers as nonvolatile memoriesen_US
dc.typeArticleen_US

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