Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)
| dc.citation.epage | 2597 | en_US |
| dc.citation.issue | 5 | en_US |
| dc.citation.spage | 2597 | en_US |
| dc.citation.volume | 18 | en_US |
| dc.citation.woscount | 0 | |
| dc.contributor.author | Gau, WC | en_US |
| dc.contributor.author | Chang, TC | en_US |
| dc.contributor.author | Lin, YS | en_US |
| dc.contributor.author | Hu, JC | en_US |
| dc.contributor.author | Chen, LJ | en_US |
| dc.contributor.author | Chang, CY | en_US |
| dc.contributor.author | Cheng, CL | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:44:54Z | |
| dc.date.available | 2014-12-08T15:44:54Z | |
| dc.date.issued | 2000-09-01 | en_US |
| dc.identifier.doi | 10.1116/1.1286102 | en_US |
| dc.identifier.issn | 0734-2101 | en_US |
| dc.identifier.journal | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1116/1.1286102 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/30314 | |
| dc.identifier.wosnumber | WOS:000089434800087 | |
| dc.language.iso | en_US | en_US |
| dc.title | Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000) | en_US |
| dc.type | Correction | en_US |