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Temperature dependent integrity of Sr0.8Bi2Ta2O9 films on ultra-thin Al2O3 buffered Si

dc.citation.epage328en_US
dc.citation.issue1en_US
dc.citation.spage325en_US
dc.citation.volume80en_US
dc.citation.woscount0
dc.contributor.authorLan, BCen_US
dc.contributor.authorChen, SYen_US
dc.contributor.authorLee, HYen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:41:02Z
dc.date.available2014-12-08T15:41:02Z
dc.date.issued2003-04-29en_US
dc.description.abstractThe annealing temperature dependent integrity of Sr0.8Bi2Ta2O9 (SBT) on ultra-thin 4 nm SiO2 and Al2O3 buffered Si was investigated in this work. Although the capacitance-voltage characteristics show hysteresis loops in both cases, the memory window of Sr0.8Bi2Ta2O9/Al2O3 capacitor is larger than that of Sr0.8Bi2Ta2O9/SiO2 capacitor. As increasing annealing temperature from 800 to 900degreesC, the grain size and memory window of polycrystalline SBT increase both cases. At 800degreesC, the leakage current density of Sr0.8Bi2Ta2O9/Al2O3 capacitor is 3.2 x 10(-8) A/cm(2) at -3V, which is low enough for deep sub-mum application. With increasing temperature to 900degreesC, the leakage current in both structures becomes smaller. (C) 2002 Elsevier Science B.V. All rights reserved.en_US
dc.identifier.doi10.1016/S0254-0584(02)00517-5en_US
dc.identifier.issn0254-0584en_US
dc.identifier.journalMATERIALS CHEMISTRY AND PHYSICSen_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0254-0584(02)00517-5en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/27947
dc.identifier.wosnumberWOS:000181736200051
dc.language.isoen_USen_US
dc.subjectSr0.8Bi2Ta2O9 (SBT)en_US
dc.subjectAl2O3 bufferen_US
dc.subjectmemory windowen_US
dc.subjectleakage currenten_US
dc.titleTemperature dependent integrity of Sr0.8Bi2Ta2O9 films on ultra-thin Al2O3 buffered Sien_US
dc.typeArticleen_US

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