Run-by-run process control of metal sputter deposition: Combining time series and extended kalman filter
| dc.citation.epage | 285 | en_US |
| dc.citation.issue | 3 | en_US |
| dc.citation.spage | 278 | en_US |
| dc.citation.volume | 20 | en_US |
| dc.citation.woscount | 11 | |
| dc.contributor.author | Chen, Juhn-Horng | en_US |
| dc.contributor.author | Kuo, Tzu-Wei | en_US |
| dc.contributor.author | Lee, An-Chen | en_US |
| dc.contributor.department | 機械工程學系 | zh_TW |
| dc.contributor.department | Department of Mechanical Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:13:35Z | |
| dc.date.available | 2014-12-08T15:13:35Z | |
| dc.date.issued | 2007-08-01 | en_US |
| dc.identifier.doi | 10.1109/TSM.2007.901392 | en_US |
| dc.identifier.issn | 0894-6507 | en_US |
| dc.identifier.journal | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1109/TSM.2007.901392 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/10497 | |
| dc.identifier.wosnumber | WOS:000248669800013 | |
| dc.language.iso | en_US | en_US |
| dc.subject | d-EWMA controller | en_US |
| dc.subject | deposition rate | en_US |
| dc.subject | extended Kalman filter | en_US |
| dc.subject | time series model | en_US |
| dc.subject | time-varying d-EWMA controller | en_US |
| dc.title | Run-by-run process control of metal sputter deposition: Combining time series and extended kalman filter | en_US |
| dc.type | Article | en_US |