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Electrical properties of high-kappa praseodymium oxide polycrystalline silicon thin-film transistors with nitrogen implantation

dc.citation.epage856en_US
dc.citation.issue2en_US
dc.citation.spage853en_US
dc.citation.volume47en_US
dc.citation.woscount1
dc.contributor.authorDeng, Chih-Kangen_US
dc.contributor.authorChang, Hong-Renen_US
dc.contributor.authorChiou, Bi-Shiouen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:12:38Z
dc.date.available2014-12-08T15:12:38Z
dc.date.issued2008-02-01en_US
dc.description.abstractThis paper demonstrates the polycrystalline silicon (poly-Si) thin-film transistors (TFTs) with high-kappa praseodymium oxide (Pr(2)O(3)) gate dielectric and nitrogen implantation to achieve high-performance characteristics for the first time. Nitrogen atoms with various dosages are implanted into amorphous silicon (alpha-Si) film to passivate the grain boundary trap states during solid-phase crystallization (SPC) annealing. From experimental results, the electrical characteristics of the Pr(2)O(3) poly-Si TFT implanted with the nitrogen dosage of 5 x 10(12) cm(-2) could be greatly improved. In addition, a better hot-harrier immunity of high-kappa Pr(2)O(3) poly-Si TFT could be also obtained.en_US
dc.identifier.doi10.1143/JJAP.47.853en_US
dc.identifier.issn0021-4922en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.47.853en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/9700
dc.identifier.wosnumberWOS:000255019700009
dc.language.isoen_USen_US
dc.subjectpolycrystalline silicon (poly-Si) thin-film transistor (TFT)en_US
dc.subjectpraseodymium oxide (Pr(2)O(3)) nitrogen implantationen_US
dc.subjectsolidphase crystallization (SPC)en_US
dc.titleElectrical properties of high-kappa praseodymium oxide polycrystalline silicon thin-film transistors with nitrogen implantationen_US
dc.typeArticleen_US

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