THE EFFECTS OF THERMAL NITRIDATION CONDITIONS ON THE RELIABILITY OF THIN NITRIDED OXIDE-FILMS
| dc.citation.epage | 145 | en_US |
| dc.citation.issue | 4 | en_US |
| dc.citation.spage | 143 | en_US |
| dc.citation.volume | 8 | en_US |
| dc.citation.woscount | 25 | |
| dc.contributor.author | TSAI, HH | en_US |
| dc.contributor.author | WU, LC | en_US |
| dc.contributor.author | WU, CY | en_US |
| dc.contributor.author | HU, CM | en_US |
| dc.contributor.department | 工學院 | zh_TW |
| dc.contributor.department | College of Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:06:05Z | |
| dc.date.available | 2014-12-08T15:06:05Z | |
| dc.date.issued | 1987-04-01 | en_US |
| dc.identifier.issn | 0741-3106 | en_US |
| dc.identifier.journal | IEEE ELECTRON DEVICE LETTERS | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/4649 | |
| dc.identifier.wosnumber | WOS:A1987G609400006 | |
| dc.language.iso | en_US | en_US |
| dc.title | THE EFFECTS OF THERMAL NITRIDATION CONDITIONS ON THE RELIABILITY OF THIN NITRIDED OXIDE-FILMS | en_US |
| dc.type | Article | en_US |