<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

Due-date assignment for wafer fabrication under demand variate environment

Loading...
Thumbnail Image

Journal Title

Journal ISSN

Volume Title

Publisher

DOI

10.1109/TSM.2007.895215

Abstract

In the semiconductor industry, dynamic changes in demand force companies to change the product mix frequently and periodically. Assigning tight but attainable due dates is a great challenge under the circumstances that the product mix changes periodically. In this paper, we consider the due-date assignment problem for wafer fabrication and present a due-date assignment model to set manufacturing due dates satisfying the target on-time-delivery rate. The contamination model is applied to tackle the effect of that product mix varies periodically. We demonstrate the effectiveness and accuracy of the proposed model by solving a real-world example taken from a wafer fabrication shop floor in an IC manufacturing factory.

Description

Citation

Endorsement

Review

Supplemented By

Referenced By