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Due-date assignment for wafer fabrication under demand variate environment

dc.citation.epage175en_US
dc.citation.issue2en_US
dc.citation.spage165en_US
dc.citation.volume20en_US
dc.citation.woscount15
dc.contributor.authorPearn, W. L.en_US
dc.contributor.authorChung, S. H.en_US
dc.contributor.authorLai, C. A.en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.date.accessioned2014-12-08T15:14:10Z
dc.date.available2014-12-08T15:14:10Z
dc.date.issued2007-05-01en_US
dc.description.abstractIn the semiconductor industry, dynamic changes in demand force companies to change the product mix frequently and periodically. Assigning tight but attainable due dates is a great challenge under the circumstances that the product mix changes periodically. In this paper, we consider the due-date assignment problem for wafer fabrication and present a due-date assignment model to set manufacturing due dates satisfying the target on-time-delivery rate. The contamination model is applied to tackle the effect of that product mix varies periodically. We demonstrate the effectiveness and accuracy of the proposed model by solving a real-world example taken from a wafer fabrication shop floor in an IC manufacturing factory.en_US
dc.identifier.doi10.1109/TSM.2007.895215en_US
dc.identifier.issn0894-6507en_US
dc.identifier.journalIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURINGen_US
dc.identifier.urihttp://dx.doi.org/10.1109/TSM.2007.895215en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/10852
dc.identifier.wosnumberWOS:000246240800014
dc.language.isoen_USen_US
dc.subjectcontamination modelen_US
dc.subjectdue-date assignmenten_US
dc.subjectflow timeen_US
dc.subjectproduct mixen_US
dc.subjectwafer fabricationen_US
dc.titleDue-date assignment for wafer fabrication under demand variate environmenten_US
dc.typeArticleen_US

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