Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]
| dc.citation.epage | en_US | |
| dc.citation.issue | 24 | en_US |
| dc.citation.volume | 90 | en_US |
| dc.citation.woscount | 0 | |
| dc.contributor.author | Hsiao, Hsiang-Yao | en_US |
| dc.contributor.author | Chen, Chih | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:13:50Z | |
| dc.date.available | 2014-12-08T15:13:50Z | |
| dc.date.issued | 2007-06-11 | en_US |
| dc.identifier.doi | 10.1063/1.2748851 | en_US |
| dc.identifier.issn | 0003-6951 | en_US |
| dc.identifier.journal | APPLIED PHYSICS LETTERS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1063/1.2748851 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/10692 | |
| dc.identifier.wosnumber | WOS:000247305400119 | |
| dc.language.iso | en_US | en_US |
| dc.title | Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)] | en_US |
| dc.type | Correction | en_US |