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Normally-off operation AlGaN/GaN MOS-HEMT with high threshold voltage

dc.citation.epageU63en_US
dc.citation.issue18en_US
dc.citation.spage1280en_US
dc.citation.volume46en_US
dc.citation.woscount16
dc.contributor.authorChang, C. -T.en_US
dc.contributor.authorHsu, T. -H.en_US
dc.contributor.authorChang, E. Y.en_US
dc.contributor.authorChen, Y. -C.en_US
dc.contributor.authorTrinh, H. -D.en_US
dc.contributor.authorChen, K. J.en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:48:19Z
dc.date.available2014-12-08T15:48:19Z
dc.date.issued2010-09-02en_US
dc.description.abstractNormally-off operation AlGaN/GaN high electron mobility transistors have been developed utilising a fluorine-based treatment technique combined with a metal-oxide-semiconductor gate architecture. Threshold voltage as high as 5.1 V was achieved by using an 16 nm-thick Al(2)O(3) gate oxide film. Additionally, the device performed a drain current density of 500 mA/mm and a peak transconductance of 100 mS/mm, which are comparable to the conventional normally-on devices.en_US
dc.identifier.doi10.1049/el.2010.1939en_US
dc.identifier.issn0013-5194en_US
dc.identifier.journalELECTRONICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1049/el.2010.1939en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/32202
dc.identifier.wosnumberWOS:000281693800025
dc.language.isoen_USen_US
dc.titleNormally-off operation AlGaN/GaN MOS-HEMT with high threshold voltageen_US
dc.typeArticleen_US

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