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公開日期標題作者
1-九月-1993CORROSION BEHAVIOR OF ELECTROLESS NICKEL-PLATING MODIFIED TIN COATINGDOONG, JC; DUH, JG; TSAI, SY; WANG, JH; CHIOU, BS; 電控工程研究所; Institute of Electrical and Control Engineering
1-九月-1986DEHYDRATION OF SYNTHESIZED CALCIA-STABILIZED ZIRCONIA FROM A COPRECIPITATION PROCESSCHIOU, BS; HSU, WY; DUH, JG; 電控工程研究所; Institute of Electrical and Control Engineering
1-九月-1991DEVELOPMENT OF TEMPERATURE-STABLE THICK-FILM DIELECTRICS .3. ROLE OF GLASS ON THE MICROSTRUCTURE EVOLUTION OF A THICK-FILM DIELECTRICCHIOU, BS; LIU, KC; DUH, JG; CHUNG, MC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-六月-1992THE EFFECT OF APPLIED FREQUENCIES AND MULTIPLE FIRING ON THE RESISTANCE OF THICK-FILM RESISTORSCHIOU, BS; HSU, WY; DUH, JG; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十一月-1988THE EFFECT OF SINTERING CONDITIONS ON THE GRAIN-GROWTH OF THE BATIO3-BASED GBBL CAPACITORSCHIOU, BS; LIN, ST; DUH, JG; 電控工程研究所; Institute of Electrical and Control Engineering
1-四月-1990ELECTRICAL BEHAVIOR OF CERIA-STABILIZED ZIRCONIA WITH RARE-EARTH-OXIDE ADDITIVESCHIOU, BS; DAI, HT; DUH, JG; 電控工程研究所; Institute of Electrical and Control Engineering
1-一月-1990EPR EVIDENCE FOR COMPENSATING DEFECTS IN BATIO3 GRAIN-BOUNDARY BARRIER LAYER CAPACITORSCHIOU, BS; LIN, ST; DUH, JG; 電控工程研究所; Institute of Electrical and Control Engineering
1-十月-1989EQUIVALENT-CIRCUIT MODEL IN GRAIN-BOUNDARY BARRIER LAYER CAPACITORSCHIOU, BS; LIN, ST; DUH, JG; CHANG, PH; 電控工程研究所; Institute of Electrical and Control Engineering
1-二月-1990FABRICATION AND ELECTRICAL BEHAVIOR OF SOL-PRECIPITATE LINBO3 CERAMICS WITH THE ADDITION OF (LIF + MGF2)CHIOU, BS; LIN, TY; DUH, JG; 電控工程研究所; Institute of Electrical and Control Engineering
1-十二月-1993FABRICATION AND PROPERTIES OF ALUMINO-BORO-SILICATE GLASS-CERAMIC SYSTEMSCHIOU, BS; TZENG, JM; DUH, JG; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十一月-1987THE INFLUENCE OF FIRING PROFILE AND ADDITIVES ON THE PTCR EFFECT AND MICROSTRUCTURE OF BATIO3 CERAMICSCHIOU, BS; KOH, CM; DUH, JG; 電控工程研究所; Institute of Electrical and Control Engineering
1-三月-1989INTERFACIAL MORPHOLOGY AND PRE-OXIDATION EFFECT IN DENTAL ALLOY OPAQUE BONDINGDUH, JG; CHIEN, WS; CHIOU, BS; 交大名義發表; National Chiao Tung University
1-六月-1990INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACESCHIOU, BS; LIU, KC; DUH, JG; PALANISAMY, PS; 電控工程研究所; Institute of Electrical and Control Engineering
1-三月-1995LIQUID-PHASE BONDING OF YTTRIA-STABILIZED ZIRCONIA WITH CAO-TIO2-SIO2 GLASSCHIOU, BS; YOUNG, CD; DUH, JG; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-六月-1993METALLIZATION OF ALUMINUM NITRIDE SUBSTRATES BY ELECTROLESS COPPER PLATINGCHIOU, BS; CHANG, JH; DUH, JG; 電控工程研究所; Institute of Electrical and Control Engineering
1-八月-1995METALLURGICAL REACTIONS AT THE INTERFACE OF SN/PB SOLDER AND ELECTROLESS COPPER-PLATED ALN SUBSTRATECHIOU, BS; CHANG, JH; DUH, JG; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-七月-1987MICROSTRUCTURE AND PROPERTIES OF MULTILAYER-DERIVED TUNGSTEN SILICIDECHIOU, BS; RAU, HL; CHANG, PH; DUH, JG; 電控工程研究所; Institute of Electrical and Control Engineering
1-十二月-1993MORPHOLOGY AND ADHESION STRENGTH IN ELECTROLESS CU METALLIZED ALN SUBSTRATECHANG, JH; DUH, JG; CHIOU, BS; 電控工程研究所; Institute of Electrical and Control Engineering
1-五月-1990MORPHOLOGY, STRENGTH AND PRE-COATING EFFECT IN YSZ/NI BONDINGDUH, JG; WU, YC; CHIOU, BS; 電子物理學系; Department of Electrophysics
1-八月-1990RUTHERFORD BACKSCATTERING SPECTROSCOPY ANALYSIS OF AR+ IMPLANTED YTTRIA STABILIZED ZIRCONIADUH, JG; WU, YS; CHOUI, BS; 電控工程研究所; Institute of Electrical and Control Engineering
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