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公開日期標題作者
1-十一月-2016Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaningWei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-十一月-2016Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaningWei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
2011Effect of Annealing on the Microstructure and Electrical Property of RuN Thin FilmsWu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-一月-2008Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishingHung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang; 交大名義發表; National Chiao Tung University
1-一月-2010Effect of Cu-Ion Concentration in Concentrated H(3)PO(4) Electrolyte on Cu Electrochemical Mechanical PlanarizationKung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-一月-2010Effect of Cu-Ion Concentration in Concentrated H3PO4 Electrolyte on Cu Electrochemical Mechanical PlanarizationKung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-三月-2012Effect of Electric Potential and Mechanical Force on Copper Electro-Chemical Mechanical PlanarizationChen, Sheng-Wen; Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-十一月-2011Effect of Electrolyte Composition on Cu Stripping of Pt Contact Pins in Semiconductor Cu Electroplating ProcessHu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
31-五月-2011Effect of N(2)/H(2) plasma treatment on the moisture adsorption of MOCVD-TiN filmsHuang, J. K.; Huang, Cheng-Liang; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
31-五月-2011Effect of N-2/H-2 plasma treatment on the moisture adsorption of MOCVD-TiN filmsHuang, J. K.; Huang, Cheng-Liang; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-三月-2014Effect of polyimide baking on bump resistance in flip-chip solder jointsCheng, Hsi-Kuei; Feng, Shien-Ping; Lai, Yi-Jen; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming; 材料科學與工程學系; 照明與能源光電研究所; Department of Materials Science and Engineering; Institute of Lighting and Energy Photonics
5-三月-2017Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materialsSu, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-七月-2010Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing SlurryLee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-二月-2013Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behaviorWang, Yu-Sheng; Chen, Kei-Wei; Cheng, Min-Yuan; Lee, Wen-Hsi; Wang, Ying-Lang; 材料科學與工程學系; 光電學院; Department of Materials Science and Engineering; College of Photonics
1-十月-2010Effects of direct current and pulse-reverse copper plating incubation behavior of self-annealingCheng, Min-Yuan; Chen, Kei-Wei; Liu, Tzeng-Feng; Wang, Ying-Lang; Feng, Hsien-Ping; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2010Effects of direct current and pulse-reverse copper plating incubation behavior of self-annealingCheng, Min-Yuan; Chen, Kei-Wei; Liu, Tzeng-Feng; Wang, Ying-Lang; Feng, Hsien-Ping; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2008Effects of plasma treatment on the precipitation of fluorine-doped silicon oxideWu, Jun; Wang, Ying-Lang; Kua, Cheng-Tzu; 材料科學與工程學系; Department of Materials Science and Engineering
1-六月-2015Effects of Varied Negative Stop Voltages on Current Self-Compliance in Indium Tin Oxide Resistance Random Access MemoryLin, Chih-Yang; Chang, Kuan-Chang; Chang, Ting-Chang; Tsai, Tsung-Ming; Pan, Chih-Hung; Zhang, Rui; Liu, Kuan-Hsien; Chen, Hua-Mao; Tseng, Yi-Ting; Hung, Ya-Chi; Syu, Yong-En; Zheng, Jin-Cheng; Wang, Ying-Lang; Zhang, Wei; Sze, Simon M.; 電子物理學系; 光電工程學系; Department of Electrophysics; Department of Photonics
1-十月-2013An electroplating method for copper plane twin boundary manufacturingWang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Nian, Jun-Nan; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
1-四月-2011Enhancement of the Thermal Stability of TiN(x) Capping Layer on the Nickel SilicidesWu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang; 照明與能源光電研究所; Institute of Lighting and Energy Photonics
顯示 3 到 22 筆資料，總共 46 筆 < 上一頁   下一頁 >