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Issue DateTitleAuthor(s)
2007A 45nm dual-port SRAM with write and read capability enhancement at low voltageWang, D. P.; Lia, H. J.; Yamauchi, H.; Chen, Y. H.; Lin, Y. L.; Lin, S. H.; Liu, D. C.; Chang, H. C.; Hwang, W.; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Oct-2008Constructing and application of multimedia TV-news archivesPao, H. T.; Chen, Y. H.; Lai, P. S.; Xu, Y. Y.; Fu, Hsin-Chia; 資訊工程學系; 管理科學系; Department of Computer Science; Department of Management Science
2012Electrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D InterconnectsChen, K. N.; Chang, Y. J.; Ko, C. T.; Hsu, S. Y.; Chen, H. Y.; Hsiao, C.; Yu, T. H.; Chen, Y. H.; Lo, W. C.; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Fabrication and characterization of electroplated nanotwinned-copper films on polymer substrates(IMPACT-IAAC 2016)Chang, Liang-Hsien; Chen, Chih; Hu, Dyi-Chung; Tain, Ray; Chen, Y. H.; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2018Group selection for processes with multiple quality characteristicsLin, Chen-ju; Pearn, W. L.; Huang, J. Y.; Chen, Y. H.; 工業工程與管理學系; Department of Industrial Engineering and Management
1-Oct-2012Intramuscular olanzapine versus intramuscular haloperidol plus lorazepam in the treatment of acute agitation in schizophreniaHwang, T. J.; Chen, Y. H.; Huang, L. C.; Huang, G. H.; Hwu, H. G.; 統計學研究所; Institute of Statistics
1-Oct-2018Microstructure and elastic modulus evolution of TiTaNb alloysWei, T. Y.; Huang, J. C.; Chao, Chih-Yeh; Wei, L. L.; Tsai, M. T.; Chen, Y. H.; 材料科學與工程學系; Department of Materials Science and Engineering
4-Mar-2019A note on Group Selection with multiple quality characteristics: power comparison of two methodsPearn, W. L.; Lin, Chen-ju; Chen, Y. H.; Huang, J. Y.; 工業工程與管理學系; Department of Industrial Engineering and Management
2016A solid-state cation exchange reaction to form multiple metal oxide heterostructure nanowiresChen, Y. H.; Huang, C. W.; Yeh, P. H.; Chen, J. Y.; Lin, T. Y.; Chang, C. F.; Wu, W. W.; 材料科學與工程學系; Department of Materials Science and Engineering
2012Structural Design, Process, and Reliability of a Wafer-Level 3D Integration Scheme with Cu TSVs Based on Micro-bump/Adhesive Hybrid Wafer BondingKo, C. T.; Hsiao, Z. C.; Chang, Y. J.; Chen, P. S.; Huang, J. H.; Fu, H. C.; Huang, Y. J.; Chiang, C. W.; Lee, C. K.; Chang, H. H.; Tsai, W. L.; Chen, Y. H.; Lo, W. C.; Chen, K. N.; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
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