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Showing results 1 to 13 of 13
Issue DateTitleAuthor(s)
1-Jun-2000The effect of substrate surface roughness on the wettability of Sn-Bi soldersChen, YY; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Feb-2003Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technologyHuang, CS; Duh, JG; Chen, YM; Wang, JH; 材料科學與工程學系; Department of Materials Science and Engineering
15-Feb-2001The influence of washing and calcination condition on urea-derived ceria-yttria-doped tetragonal zirconia powdersLin, JD; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
15-Feb-2003Low temperature sintering and crystallisation behaviour of low loss anorthite-based glass-ceramicsLo, CL; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2002Low-voltage cathodoluminescence properties of the Y2O2S : Eu red light emitting phosphor screen in field-emission environmentsLo, CL; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
23-Jul-2001Luminescent mechanisms of ZnS : Cu : Cl and ZnS : Cu : Al phosphorsChen, YY; Duh, JG; Chiou, BS; Peng, CG; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Dec-2003Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip packageHuang, CS; Duh, JG; Chen, YM; 材料科學與工程學系; Department of Materials Science and Engineering
3-Oct-2002Microstructure characteristics for anorthite composite glass with nucleating agents of TiO2 under non-isothermal crystallizationLo, CL; Duh, JG; Chiou, BS; Lee, WH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
15-Aug-2001Synthesis of Eu3+-activated yttrium oxysulfide red phosphor by flux fusion methodLo, CL; Duh, JG; Chiou, BS; Peng, CC; Ozawa, L; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Dec-1995Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrateChiou, BS; Chang, JH; Duh, JG; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-2000Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder jointsMiao, HW; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-May-2001Wettability of electroless Ni in the under bump metallurgy with lead free solderYoung, BL; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2006Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solderLin, YC; Duh, JG; Chiou, BS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
Showing results 1 to 13 of 13