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Showing results 1 to 9 of 9
Issue DateTitleAuthor(s)
1-May-2004Alkylation of nanoporous silica thin films by high density plasma chemical vapor deposition of a-SIC : HPan, FM; Wu, BW; Cho, AT; Tsai, KC; Tsai, TG; Chao, KJ; Chen, JY; Chang, L; 材料科學與工程學系; Department of Materials Science and Engineering
1-Sep-2002Axial load behavior of stiffened concrete-filled steel columnsHuang, CS; Yeh, YK; Liu, GY; Hu, HT; Tsai, KC; Weng, YT; Wang, SH; Wu, MH; 土木工程學系; Department of Civil Engineering
1-May-2001Characteristics of fluorinated amorphous carbon films and implementation of 0.15 mu m Cu/a-C : F damascene interconnectionShieh, JM; Suen, SC; Tsai, KC; Dai, BT; Wu, YC; Wu, YH; 材料科學與工程學系; Department of Materials Science and Engineering
2006High-reliability Ta2O5 metal-insulator-metal capacitors with Cu-based electrodesTsai, KC; Wu, WF; Chao, CG; Kuan, CP; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2004Influence of N2O plasma treatment on microstructure and thermal stability of WNx barriers for Cu interconnectionTsai, KC; Wu, WF; Chen, JC; Pan, TJ; Chao, CG; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jan-2005MR-FQ: A fair scheduling algorithm for wireless networks with variable transmission ratesWang, YC; Tseng, YC; Chen, WT; Tsai, KC; 資訊工程學系; Department of Computer Science
1-Aug-2005Novel multilayered Ti/TiN diffusion barrier for Al metallizationWu, WF; Tsai, KC; Chao, CG; Chen, JC; Ou, KL; 材料科學與工程學系; Department of Materials Science and Engineering
2005Numerical and experimental analysis of Cu diffusion in plasma-treated tungsten barrierTsai, KC; Wu, WF; Chen, JC; Pan, TJ; Chao, CG; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jul-2002Reduction of etching plasma damage on low dielectric constant fluorinated amorphous carbon films by multiple H-2 plasma treatmentShieh, JM; Tsai, KC; Dai, BT; Wu, YC; Wu, YH; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 9 of 9