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Issue DateTitleAuthor(s)
15-Oct-1997Anion-terminated zinc-blende CdS(100) surfaceLin, CM; Tsai, MH; Yang, TJ; Chuu, DS; 電子物理學系; Department of Electrophysics
1-Jan-2006Caching in I-CSCF of UMTS IP multimedia subsystemLin, YB; Tsai, MH; 資訊工程學系; Department of Computer Science
1995A comparative study of CVD TiN and CVD TaN diffusion barriers for copper interconnectionSun, SC; Tsai, MH; Chiu, HT; Chuang, SH; Tsai, CE; 奈米中心; Nano Facility Center
1-May-1996Comparison of the diffusion barrier properties of chemical-vapor-deposited TaN and sputtered TaN between Cu and SiTsai, MH; Sun, SC; Tsai, CE; Chuang, SH; Chiu, HT; 應用化學系; 電子工程學系及電子研究所; 奈米中心; Department of Applied Chemistry; Department of Electronics Engineering and Institute of Electronics; Nano Facility Center
1-May-1996Comparison of the diffusion barrier properties of chemical-vapor-deposited TaN and sputtered TaN between Cu and SiTsai, MH; Sun, SC; Tsai, CE; Chuang, SH; Chiu, HT; 應用化學系; 電子工程學系及電子研究所; Department of Applied Chemistry; Department of Electronics Engineering and Institute of Electronics
7-Dec-2005Comparison of the electronic structures of AIN nanotips grown on p- and n-type Si substratesChiou, JW; Tsai, HM; Pao, CW; Dong, CL; Chang, CL; Chien, FZ; Pong, WF; Tsai, MH; Shi, SC; Chen, CF; Chen, LC; Chen, KH; Hong, IH; Chen, CH; Lin, HJ; Guo, JH; 材料科學與工程學系; Department of Materials Science and Engineering
4-Jul-2005Direct experimental evidence of hybridization of Pb states with O 2p states in ferroelectric perovskite oxidesJan, JC; Tsai, HM; Pao, CW; Chiou, JW; Asokan, CK; Kumar, KPK; Pong, WF; Tang, YH; Tsai, MH; Kuo, SY; Hsieh, WF; 光電工程學系; Department of Photonics
6-Sep-2001Dynamic mechanical properties of polyimide/poly(silsesquioxane)-like hybrid filmsTsai, MH; Whang, WT; 材料科學與工程學系; Department of Materials Science and Engineering
29-Jan-1996Effect of rapid thermal annealing on the electrical and physical properties of metalorganic chemical-vapor-deposited TiNSun, SC; Tsai, MH; 奈米中心; Nano Facility Center
20-Oct-2003Effect of the Ca content on the electronic structure of Pb1-xCaxTiO3 perovskitesJan, JC; Kumar, KPK; Chiou, JW; Tsai, HM; Shih, HL; Hsueh, HC; Ray, SC; Asokan, K; Pong, WF; Tsai, MH; Kuo, SY; Hsieh, WF; 光電工程學系; Department of Photonics
1-Feb-1996An efficient improvement for barrier effect of W-filled contactYeh, WK; Chan, KY; Chang, TC; Tsai, MH; Chen, SH; Chen, MC; Lin, MS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Dec-1995Electrical characteristics and annealing study of boron-doped polycrystalline diamond filmsChen, SH; Chen, SL; Tsai, MH; Shyu, JJ; Chen, CF; 材料科學與工程學系; Department of Materials Science and Engineering
1-Feb-1997Electrical characteristics and deep-level admittance spectroscopies of low-temperature grown GaAs p-i-n structuresChen, JF; Chen, NC; Wang, PY; Tsai, MH; 交大名義發表; 電子物理學系; National Chiao Tung University; Department of Electrophysics
1-Mar-2002Growth mechanism and properties of the large area well-aligned carbon nano-structures deposited by microwave plasma electron cyclotron resonance chemical vapor depositionLin, CH; Chang, HL; Tsai, MH; Kuo, CT; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jun-2001High temperature lifetime of polyimide/poly(silsesquioxane)-like hybrid filmsTsai, MH; Whang, WT; 材料科學與工程學系; Department of Materials Science and Engineering
1-Apr-2001Low dielectric polyimide/poly(silsesquioxane)-like nanocomposite materialTsai, MH; Whang, WT; 材料科學與工程學系; Department of Materials Science and Engineering
1-Dec-1995Metal-organic chemical vapor deposition of tantalum nitride barrier layers for ULSI applicationsTsai, MH; Sun, SC; Lee, CP; Chiu, HT; Tsai, CE; Chuang, SH; Wu, SC; 應用化學系; 電子工程學系及電子研究所; 奈米中心; Department of Applied Chemistry; Department of Electronics Engineering and Institute of Electronics; Nano Facility Center
4-Mar-1996Metalorganic chemical vapor deposition of tungsten nitride for advanced metallizationTsai, MH; Sun, SC; Chiu, HT; Chuang, SH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1995Performance of MOCVD tantalum nitride diffusion barrier for copper metallizationSun, SC; Tsai, MH; Tsai, CE; Chiu, HT; 奈米中心; Nano Facility Center
30-Jan-2004Physical and mechanical properties of polyimide/titania hybrid filmsChiang, PC; Whang, WT; Tsai, MH; Wu, SC; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 1 to 20 of 23  next >