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Showing results 1 to 7 of 7
Issue DateTitleAuthor(s)
1-Mar-2013Backside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu/Sn and BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Yu, Tsung-Han; Chiang, Cheng-Hao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2013Electrical and Reliability Investigation of Cu TSVs With Low-Temperature Cu/Sn and BCB Hybrid Bond SchemeChang, Yao-Jen; Ko, Cheng-Ta; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jun-2012A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory ApplicationKo, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Yao-Jen; Chen, Peng-Shu; Hwang, Yu-Jiau; Fu, Huan-Chun; Huang, Jui-Hsiung; Chiang, Chia-Wen; Sheu, Shyh-Shyuan; Chen, Yu-Hua; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2017三維積體電路異質整合之聚醯亞胺材料應用於銅/錫與銅/銅非對稱混合接合研究黃諺鈞; 陳冠能; Huang, Yen-Jun; Chen, Kuan-Neng; 電子研究所
2011三維積體電路關鍵技術之金屬高分子混合接合研究張耀仁; Chang, Yao-Jen; 陳冠能; Chen, Kuan-Neng; 電子研究所
2016三維積體電路關鍵技術與異質接合製程平台之電性與可靠度研究張耀仁; 陳冠能; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系 電子研究所
2016單邊加熱法應用於三維積體電路晶片對基板接合與低溫非對稱混合接合研究張瀞云; 陳冠能; Chang, Ching-Yun; Chen, Kuan-Neng; 電子工程學系 電子研究所
Showing results 1 to 7 of 7