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1-一月-2017Development and Electrical Investigation of Through Glass Via and Through Si Via in 3D IntegrationChang, Geng-Ming; Lee, Shih-Wei; Chang, Ching-Yun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2017Fine-Feature Cu/In Interconnect Bonding Using Single Sided Heating and Chip-to-Wafer Bonding TechnologyLee, Shih-Wei; Chang, Ching-Yun; Chang, Geng-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2017A Novel Sealing Redistribution Layer Approach for Through-Glass via FabricationLee, Shih-Wei; Chang, Geng-Ming; Chang, Ching-Yun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Single Sided Heating Method for Chip-to-Wafer Bonding with Submicron Cu/In InterconnectsChang, Ching-Yun; Lee, Shih-Wei; Chang, Geng-Ming; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016單邊加熱法應用於三維積體電路晶片對基板接合與低溫非對稱混合接合研究張瀞云; 陳冠能; Chang, Ching-Yun; Chen, Kuan-Neng; 電子工程學系 電子研究所
2017概念結合訓練、詮釋嘗試次數與概念抽象程度對新概念產生的影響張瀞云; 洪瑞雲; Chang, Ching-Yun; Horng, Ruey-Yun; 工業工程與管理系所
2008表現登革熱二型病毒NS2,NS4基因及探討四環黴素衍生物對登革熱病毒的抑制作用張□云; Chang, Ching-Yun; 楊昀良; Yang, Yun-Liang; 生物科技學系
顯示 1 到 7 筆資料，總共 7 筆