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顯示 1 到 11 筆資料，總共 11 筆
公開日期標題作者
1-一月-20142.5D Heterogeneously Integrated Bio-Sensing Microsystem for Multi-Channel Neural-Sensing ApplicationsHuang, Po-Tsang; Chou, Lei-Chun; Huang, Teng-Chieh; Wu, Shang-Lin; Wang, Tang-Shuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chen, Kuan-Neng; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Cheng, Ming-Hsiang; Lin, Yueh-Lung; Tong, Ho-Ming; 交大名義發表; National Chiao Tung University
1-十二月-20142.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing ApplicationsHuang, Po-Tsang; Wu, Shang-Lin; Huang, Yu-Chieh; Chou, Lei-Chun; Huang, Teng-Chieh; Wang, Tang-Hsuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Tong, Ho-Ming; 交大名義發表; National Chiao Tung University
三月-2017Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC ApplicationsCheng, Chuan-An; Tsai, Tsung-Yen; Huang, Yu-Hsiang; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十月-2012Effects of Bonding Technology and Thinning Process in Three-Dimensional Integration on Device CharacteristicsLu, Cheng-Hsien; Cheng, Chuan-An; Ho, Chia-Hua; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015Electrical Investigation of Cu Pumping in Through-Silicon Vias for BEOL Reliability in 3D IntegrationCheng, Chuan-An; Sugie, Ryuichi; Uchida, Tomoyuki; Chen, Kou-Hua; Chiu, Chi-Tsung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2017Feasibility Investigation of Amorphous Silicon as Release Layer in Temporary Bonding for 3-D Integration and FOWLP SchemeCheng, Chuan-An; Huang, Yu-Hsiang; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2017Polymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Cheng, Chuan-An; Huang, Yen-Jun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2016Study of a Novel Amorphous Silicon Temporary Bonding and Corresponding Laser Assisted De-bonding TechnologyHuang, Yu-Hsiang; Liang, Hao-Wen; Cheng, Chuan-An; Lin, Chien-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2014A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe ArrayChou, Lei-Chun; Lee, Shih-Wei; Cheng, Chuan-An; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng; 交大名義發表; National Chiao Tung University
2016Wafer-Level MOSFET with Submicron Photolysis Polymer Temporary Bonding Technology Using Ultra-Fast Laser Ablation for 3DIC ApplicationCheng, Chuan-An; Huang, Yu-Hsiang; Lin, Chicn-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2017暫時性接合與雷射解膠技術於三維異質整合平台之研究鄭筌安; 陳冠能; Cheng, Chuan-An; Chen, Kuan-Neng; 電子研究所
顯示 1 到 11 筆資料，總共 11 筆