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瀏覽 的方式： 作者 Cheng, Hsi-Kuei

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公開日期標題作者
1-三月-2014Effect of polyimide baking on bump resistance in flip-chip solder jointsCheng, Hsi-Kuei; Feng, Shien-Ping; Lai, Yi-Jen; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming; 材料科學與工程學系; 照明與能源光電研究所; Department of Materials Science and Engineering; Institute of Lighting and Energy Photonics
15-二月-2015Interfacial reactions between Cu and SnAgCu solder doped with minor NiCheng, Hsi-Kuei; Huang, Chin-Wen; Lee, Hsuan; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming; 材料科學與工程學系; 照明與能源光電研究所; Department of Materials Science and Engineering; Institute of Lighting and Energy Photonics
八月-2016Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion BarriersCheng, Hsi-Kuei; Lin, Yu-Jie; Chen, Chih-Ming; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; 材料科學與工程學系; 照明與能源光電研究所; Department of Materials Science and Engineering; Institute of Lighting and Energy Photonics
1-五月-2015Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature AnnealingCheng, Hsi-Kuei; Lin, Yu-Jie; Chang, Hou-Chien; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming; 材料科學與工程學系; 照明與能源光電研究所; Department of Materials Science and Engineering; Institute of Lighting and Energy Photonics
顯示 1 到 4 筆資料，總共 4 筆