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公開日期標題作者
20153D Heterogeneous Integration Structure Based on 40 nm- and 0.18 mu m- Technology NodesHu, Yu-Chen; Lin, Chun-Pin; Hsieh, Yu-Sheng; Chang, Nien-Shyang; Gallegos, Anthony J.; Souza, Terry; Chen, Wei-Chia; Sheu, Ming-Hwa; Chang, Chien-Chi; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015Development and Electrical Investigation of Novel Fine-Pitch Cu/Sn Pad Bumping Using Ultra-Thin Buffer Layer Technique in 3D IntegrationHsieh, Yu-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng; 電機學院; College of Electrical and Computer Engineering
1-一月-2017Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration ApplicationsChen, Hsiu-Chi; Kho, Yi-Tung; Huang, Yen-Jun; Hsieh, Yu-Sheng; Chang, Yao-Jen; Tang, Ya-Sheng; Yu, Ting-Yang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-七月-2018Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic BondingTang, Ya-Sheng; Chen, Hsiu-Chi; Kho, Yi-Tung; Hsieh, Yu-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015Investigation of Low Temperature Cu/In Bonding in 3D IntegrationHsieh, Yu-Sheng; Shen, Ting-Ting; Chien, Yu-San; Chen, Kuan-Neng; Shinozaki, Yuko; Kawasaki, Naohiko; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-六月-2015Modeling and Characterization of TSV Capacitor and Stable Low-Capacitance Implementation for Wide-I/O ApplicationChang, Yao-Yen; Ko, Cheng-Ta; Yu, Tsung-Han; Hsieh, Yu-Sheng; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十一月-2014Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC ApplicationChang, Yao-Jen; Hsieh, Yu-Sheng; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2015三維積體電路之超薄緩衝層技術於細間距銅/錫襯墊接合開發及電性研究謝佑生; Hsieh, Yu-Sheng; 陳冠能; Chen, Kuan-Neng; 電子工程學系 電子研究所
2017中國債務結構與風險剖析謝佑聲; 承立平; 黃宜侯; Hsieh, Yu-Sheng; Cheng, Li-Ping; Huang, Yi-Hou; 管理學院財務金融學程
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