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Browsing by Author Kho, Yi-Tung

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Showing results 1 to 7 of 7
Issue DateTitleAuthor(s)
1-Mar-2019Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2018Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-level Hybrid Bonding in 3D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Yang, Yu-Tao; Chen, Yu-Pei; Chen, Chiao-Pei; Hung, Tsung-Tai; Chen, Chiu-Feng; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration ApplicationsChen, Hsiu-Chi; Kho, Yi-Tung; Huang, Yen-Jun; Hsieh, Yu-Sheng; Chang, Yao-Jen; Tang, Ya-Sheng; Yu, Ting-Yang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jul-2018Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic BondingTang, Ya-Sheng; Chen, Hsiu-Chi; Kho, Yi-Tung; Hsieh, Yu-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-2017Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders JointsTang, Ya-Sheng; Derakhshandeh, Jaber; Kho, Yi-Tung; Chang, Yao-Jen; Slabbekoorn, John; De Preter, Inge; Vanstreels, Kris; Rebibis, Kenneth June; Beyne, Eric; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jan-2017Polymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Cheng, Chuan-An; Huang, Yen-Jun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2017三維積體電路異質整合技術開發之聚醯亞胺材料與鈍化層附著強度以及鈷金屬超薄緩衝層應用於混合接合之研究許浴桐; 陳冠能; Kho, Yi-Tung; Chen, Kuan-Neng; 電機資訊國際學程
Showing results 1 to 7 of 7