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公開日期標題作者
1-九月-2014Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration ApplicationsShih, Jian-Yu; Huang, Wen-Chun; Ko, Cheng-Ta; Yang, Zheng; Hu, Sheng-Hsiang; Leu, Jihperng; Chou, Keng C.; Chen, Kuan-Neng; 交大名義發表; 材料科學與工程學系; 電子工程學系及電子研究所; National Chiao Tung University; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
七月-2016Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer DielectricHuang, Yen-Jun; Hsieh, Yen-Hui; Shih, Jian-Yu; Chen, Han-Chun; Leu, Jihperng; Chen, Kuan-Neng; 材料科學與工程學系; 電子物理學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-七月-2019Advanced metallization for ULSI applications FOREWORDNakatsuka, Osamu; Baklanov, Mikhail R.; Zhao, Chao; Chan, Mansun; Leu, Jihperng; Luo, Jun; Qu, Xin-Ping; Saitoh, Takeyasu; Suzuki, Keisuke; Yokogawa, Shinji; 交大名義發表; National Chiao Tung University
3-九月-2012Anisotropic optical transmission of femtosecond laser induced periodic surface nanostructures on indium-tin-oxide filmsWang, Chih; Wang, Hsuan-I; Luo, Chih-Wei; Leu, Jihperng; 材料科學與工程學系; 電子物理學系; Department of Materials Science and Engineering; Department of Electrophysics
1-十一月-2018Broadband UV-assisted thermal annealing of low-k silicon carbonitride films using a C-rich silazane precursorChang, Wei-Yuan; Chung, Hau-Ting; Chen, Yi-Chang; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
2013Comparison of H-2 and NH3 Treatments for Copper InterconnectsChang, Yu-Min; Leu, Jihperng; Lin, Bing-Hong; Wang, Ying-Lung; Cheng, Yi-Lung; 材料科學與工程學系; Department of Materials Science and Engineering
28-二月-2013Dye-sensitized solar cells based on agarose gel electrolytes using allylimidazolium iodides and environmentally benign solventsHsu, Hsin-Ling; Tien, Cheng-Fang; Yang, Ya-Ting; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
2011Effect of Curing on the Porogen Size in the Low-k MSQ/SBS Hybrid FilmsChen, Yu-Han; Jeng, U-Ser; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
5-十月-2014Effect of layout on electromigration characteristics in copper dual damascene interconnectsCheng, Y. L.; Chang, Y. M.; Leu, Jihperng; Bo, T. C.; Wang, Y. L.; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2013Effect of Moisture on Electrical and Reliability Characteristics for Dense and Porous Low-k DielectricsCheng, Yi-Lung; Huang, Jun-Fu; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2014Effect of moisture on electrical properties and reliability of low dielectric constant materialsCheng, Yi-Lung; Leon, Ka-Wai; Huang, Jun-Fu; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2014Effect of NH3/N-2 ratio in plasma treatment on porous low dielectric constant SiCOH materialsHuang, Jun-Fu; Bo, Tain-Cih; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; Cheng, Yi-Lung; 材料科學與工程學系; Department of Materials Science and Engineering
1-六月-2014Effect of pore size/distribution in TiO2 films on agarose gel electrolyte-based dye-sensitized solar cellsHsu, Hsin-Ling; Tien, Cheng-Fang; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2015Effect of Porogen Incorporation on Pore Morphology of Low-k SiCxNy Films Prepared Using PECVDTu, Hung-En; Su, Chun-Jen; Jeng, U-Ser; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2012Effect of surfactants on the porogen size in the low-k methylsilsesquioxane/polystyrene hybrid filmsChen, Yu-Han; Tu, Hung-En; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
15-一月-2013Effect of thermal treatment on physical, electrical properties and reliability of porogen-containing and porogen-free ultralow-k dielectricsChang, Yu-Min; Chang, Wei-Yuan; Huang, Jun-Fu; Leu, Jihperng; Cheng, Yi-Lung; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2014Effect of UV curing time on physical and electrical properties and reliability of low dielectric constant materialsKao, Kai-Chieh; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; Cheng, Yi-Lung; 材料科學與工程學系; Department of Materials Science and Engineering
25-十月-2011Effects of CF(4) plasma treatment on the moisture uptake, diffusion, and WVTR of poly(ethylene terephthalate) flexible filmsWang, Chih; Lai, Po-Cheng; Syu, Shu Hao; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
25-十月-2011Effects of CF4 plasma treatment on the moisture uptake, diffusion, and WVTR of poly(ethylene terephthalate) flexible filmsWang, Chih; Lai, Po-Cheng; Syu, Shu Hao; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-2011Effects of environmentally benign solvents in the agarose gel electrolytes on dye-sensitized solar cellsHsu, Hsin-Ling; Hsu, Wan-Ting; Leu, Jihperng; 材料科學與工程學系; Department of Materials Science and Engineering
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