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顯示 1 到 16 筆資料，總共 16 筆
公開日期標題作者
29-八月-1997Computation of unstable liquid metal convection in a vertical closed cylinder heated from the side and cooled from aboveLi, YH; Lin, KC; Lin, TF; 機械工程學系; Department of Mechanical Engineering
29-八月-1997Computation of unstable liquid metal convection in a vertical closed cylinder heated from the side and cooled from aboveLi, YH; Lin, KC; Lin, TF; 機械工程學系; Department of Mechanical Engineering
1-九月-2002The effect of plating current densities on self-annealing Behaviors of electroplated copper filmsChang, SC; Shieh, JM; Dai, BT; Feng, MS; Li, YH; 材料科學與工程學系; Department of Materials Science and Engineering
1-六月-2000Effects of thermal boundary condition on buoyancy driven transitional air flow in a vertical cylinder heated from belowCheng, TC; Li, YH; Lin, TF; 機械工程學系; Department of Mechanical Engineering
1-六月-1998Experimental study of unsteady thermal characteristics and rotation induced stabilization of air convection in a bottom heated rotating vertical cylinderKer, YT; Li, YH; Lin, TF; 機械工程學系; Department of Mechanical Engineering
1-五月-2001Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copperChang, SC; Shieh, JM; Lin, KC; Dai, BT; Wang, TC; Chen, CF; Feng, MS; Li, YH; Lu, CP; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2002Leveling effects of copper electrolytes with hybrid-mode additivesLin, KC; Shieh, JM; Chang, SC; Dai, BT; Chen, CF; Feng, MS; Li, YH; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-2002Microleveling mechanisms and applications of electropolishing on planarization of copper metallizationChang, SC; Shieh, JM; Huang, CC; Dai, BT; Li, YH; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
2003A novel wafer reclaim method for silicon carbide filmTsui, BY; Fang, KL; Wu, CH; Li, YH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十月-1996Numerical simulation of flow pattern formation in a bottom heated cylindrical fluid layerLi, YH; Chu, TC; Lin, TF; 機械工程學系; Department of Mechanical Engineering
1-十月-1996Numerical simulation of flow pattern formation in a bottom heated cylindrical fluid layerLi, YH; Chu, TC; Lin, TF; 機械工程學系; Department of Mechanical Engineering
1-九月-2003A one-step single-cleaning solution for CMOS processesChao, TS; Yeh, CH; Pan, TM; Lei, TF; Li, YH; 電子物理學系; 電子工程學系及電子研究所; Department of Electrophysics; Department of Electronics Engineering and Institute of Electronics
1-四月-2006The port-to-port isolation of the downconversion P-type micromixer using different N-well topologiesTseng, SC; Meng, CC; Li, YH; Huang, GW; 電信工程研究所; Institute of Communications Engineering
1-七月-2003Stability investigation of single-wafer process by using a spin etcherKang, TK; Wang, CC; Tsui, BY; Yang, WL; Chien, FT; Yang, SY; Chang, CY; Li, YH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-五月-2003Superpolishing for planarizing copper damascene interconnectsChang, SC; Shieh, JM; Dai, BT; Feng, MS; Li, YH; Shih, CH; Tsai, MH; Shue, SL; Liang, RS; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-2002Wetting effect on gap filling submicron damascene by an electrolyte free of levelersChang, SC; Shieh, JM; Lin, KC; Dai, BT; Wang, TC; Chen, CF; Feng, MS; Li, YH; Lu, CP; 材料科學與工程學系; Department of Materials Science and Engineering
顯示 1 到 16 筆資料，總共 16 筆