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公開日期標題作者
20053-D simulation on current density distribution in flip-cbip solder joints with thick CuUBM under current stressingLiang, SW; Shao, TL; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
24-四月-2006Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigrationLiang, SW; Chang, YW; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
2005Electromigration in eutectic SnPb solder bumps with Ni/Cu UBMChiu, SH; Liang, SW; Chen, C; Lin, SS; Chou, CM; Liu, YC; Chen, KH; 材料科學與工程學系; Department of Materials Science and Engineering
1-三月-2006Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripesChou, CK; Chen, CA; Liang, SW; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2006Relieving the current crowding effect in flip-chip solder joints during current stressingLiang, SW; Shao, TL; Chen, C; Yeh, ECC; Tu, KN; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2006Temperature and current-density distributions in flip-chip solder joints with Cu tracesHsu, CY; Yao, DJ; Liang, SW; Chen, C; Yeh, ECC; 材料科學與工程學系; Department of Materials Science and Engineering
顯示 1 到 6 筆資料，總共 6 筆