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公開日期標題作者
1-十二月-2002Active devices under CMOS I/O padsChou, KY; Chen, MJ; Liu, CW; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2005Architecture for area-efficient 2-D transform in H.264/AVCKuo, YT; Lin, TY; Liu, CW; Jen, CW; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
15-四月-2001Characteristics of YBa2Cu3O7 thin films deposited on substrates buffered by various TiO2 layersLin, PL; Liu, CW; Hsieh, CC; Wu, KH; Juang, JY; Uen, TM; Lin, JY; Gou, YS; 電子物理學系; 物理研究所; Department of Electrophysics; Institute of Physics
1-十一月-2001Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device applicationCheng, YL; Wang, YL; Liu, CW; Wu, YL; Lo, KY; Liu, CP; Lan, JK; 材料科學與工程學系; Department of Materials Science and Engineering
1-十二月-1995Chemical mechanical polishing of PSG and BPSG dielectric films: The effect of phosphorus and boron concentrationLiu, CW; Dai, BT; Yeh, CF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-二月-2006A compact DSP core with static floating-point arithmeticLin, TJ; Lin, HY; Chao, CM; Liu, CW; Jen, CW; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2004Complexity-aware design of DA-based fir filtersChen, CC; Lin, TJ; Liu, CW; Jen, CW; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-一月-2004Copper surface protection with a completely enclosed copper structure for a damascene processWang, TC; Hsieh, TE; Wang, YL; Wu, YL; Lo, KY; Liu, CW; Chen, KW; 材料科學與工程學系; Department of Materials Science and Engineering
2005A dynamic normalization technique for decoding LDPC codesLiao, YC; Lin, CC; Liu, CW; Chang, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
15-十二月-1996Effects of mechanical characteristics on the chemical-mechanical polishing of dielectric thin filmsTseng, WT; Liu, CW; Dai, BT; Yeh, CF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-一月-2004Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnectChen, KW; Wang, YL; Liu, CP; Yang, K; Chang, L; Lo, KY; Liu, CW; 材料科學與工程學系; Department of Materials Science and Engineering
2005Hierarchical instruction encoding for VLIW digital signal processorsLiu, CH; Lin, TJ; Chao, CM; Hsiao, PC; Lin, LC; Chen, SK; Huang, CW; Liu, CW; Jen, CW; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
15-一月-2004Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallizationCheng, YL; Wang, YL; Liu, CP; Wu, YL; Lo, KY; Liu, CW; Lan, JK; Ay, C; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2001Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic processLan, JK; Wang, YL; Lo, KY; Liu, CP; Liu, CW; Wang, JK; Cheng, YL; Chau, CG; 材料科學與工程學系; Department of Materials Science and Engineering
1-九月-1996A Laplace transform solution for tracer tests in a radially convergent flow field with upstream dispersionChen, JS; Liu, CW; Chen, CS; Yeh, HD; 環境工程研究所; Institute of Environmental Engineering
1-九月-1996A Laplace transform solution for tracer tests in a radially convergent flow field with upstream dispersionChen, JS; Liu, CW; Chen, CS; Yeh, HD; 環境工程研究所; Institute of Environmental Engineering
2005Lightweight arithmetic units for VLSI digital signal processorsOu, SH; Lin, TJ; Lin, HY; Chao, CM; Liu, CW; Jen, CW; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-九月-2003Mechanisms of circular defects for shallow trench isolation oxide depositionLan, JK; Wang, YL; Liu, CP; Chao, CG; Ay, CY; Liu, CW; Cheng, YL; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-1996Modeling of the wear mechanism during chemical-mechanical polishingLiu, CW; Dai, BT; Tseng, WT; Yeh, CF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
30-一月-2004Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant materialCheng, YL; Wang, YL; Wu, YL; Liu, CP; Liu, CW; Lan, JK; O'Neil, ML; Ay, C; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
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