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公開日期標題作者
1-三月-2019Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2020Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid BondingLu, Cheng-Hsien; Yang, Yi-Lun; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2018Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-level Hybrid Bonding in 3D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Yang, Yu-Tao; Chen, Yu-Pei; Chen, Chiao-Pei; Hung, Tsung-Tai; Chen, Chiu-Feng; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-七月-2019Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding for 3-D Heterogeneous IntegrationLu, Cheng-Hsien; Jhu, Shu-Yan; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十月-2012Effects of Bonding Technology and Thinning Process in Three-Dimensional Integration on Device CharacteristicsLu, Cheng-Hsien; Cheng, Chuan-An; Ho, Chia-Hua; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2017Polymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D IntegrationLu, Cheng-Hsien; Kho, Yi-Tung; Cheng, Chuan-An; Huang, Yen-Jun; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
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