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公開日期標題作者
1-五月-2006Aging influence of poly(ethylene glycol) suppressors of Cu electrolytes on gaps fillingLiu, SH; Li, TC; Chen, C; Shieh, JM; Dai, BT; Hensen, K; Cheng, SS; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-1998Broadly tunable self-starting passively mode-locked Ti : sapphire laser with triple-strained quantum-well saturable Bragg reflectorShieh, JM; Huang, TC; Huang, KF; Wang, CL; Pan, CL; 電子物理學系; 光電工程學系; Department of Electrophysics; Department of Photonics
1-十一月-1998Broadly tunable self-starting passively mode-locked Ti : sapphire laser with triple-strained quantum-well saturable Bragg reflectorShieh, JM; Huang, TC; Huang, KF; Wang, CL; Pan, CL; 電子物理學系; 光電工程研究所; Department of Electrophysics; Institute of EO Enginerring
1-五月-2001Characteristics of fluorinated amorphous carbon films and implementation of 0.15 mu m Cu/a-C : F damascene interconnectionShieh, JM; Suen, SC; Tsai, KC; Dai, BT; Wu, YC; Wu, YH; 材料科學與工程學系; Department of Materials Science and Engineering
1-六月-1998Characterization and reduction of phase noise in passively mode-locked Ti : sapphire lasers with intracavity saturable absorbersShieh, JM; Liu, SC; Pan, CL; 光電工程學系; Department of Photonics
1-十一月-2000Characterization of additive systems for damascene Cu electroplating by the superfilling profile monitorChiu, SY; Shieh, JM; Chang, SC; Lin, KC; Dai, BT; 材料科學與工程學系; Department of Materials Science and Engineering
27-三月-2006Dopant profile engineering by near-infrared femtosecond laser activationWang, YC; Pan, CL; Shieh, JM; Dai, BT; 光電工程學系; Department of Photonics
1-八月-1999Dynamic pulse buildup in continuous-wave passively mode-locked picosecond Ti: Sapphire/DDI and Ti: Sapphire/IR140 lasersPan, CL; Pu, NW; Shieh, JM; 光電工程學系; Department of Photonics
1-九月-2002The effect of plating current densities on self-annealing Behaviors of electroplated copper filmsChang, SC; Shieh, JM; Dai, BT; Feng, MS; Li, YH; 材料科學與工程學系; Department of Materials Science and Engineering
15-七月-1996Effects of intracavity dispersion on the starting dynamics of continuous-wave passively mode-locked Ti:sapphire/DDI lasersShieh, JM; Twu, HM; Pan, CL; 交大名義發表; 光電工程學系; National Chiao Tung University; Department of Photonics
1-五月-2002Electroplating copper in sub-100 nm gaps by additives with low consumption and diffusion abilityLin, KC; Shieh, JM; Chang, SC; Dai, BT; Chen, CF; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
2005Emission of bright blue light from mesoporous silica with dense Si (Ge) nanocrystalsCho, AT; Shieh, JM; Shieh, J; Lai, YF; Dai, BT; Pan, FM; Kuo, HC; Lin, YC; Chao, KJ; Liu, PH; 材料科學與工程學系; 光電工程學系; Department of Materials Science and Engineering; Department of Photonics
1-八月-2001Expanding the process window and reducing the optical proximity effect by post-exposure delayKu, CY; Shieh, JM; Chiou, TB; Lin, HK; Lei, TF; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
14-十月-2004High-voltage amplifier uses simplified circuitTsai, JI; Shieh, JM; Liao, TS; Teng, CC; 交大名義發表; National Chiao Tung University
1-三月-2003Improving the quality of electroplated copper films by rapid thermal annealingChang, SC; Shieh, JM; Dai, BT; Feng, MS; Wang, YL; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2002Investigation of carrying agents on microstructure of electroplated Cu filmsShieh, JM; Chang, SC; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-六月-2002Investigation of inductively coupled plasma gate oxide on low temperature polycrystalline-silicon TFTsTseng, CH; Chang, TK; Chu, FT; Shieh, JM; Dai, BT; Cheng, HC; Chin, A; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-八月-2002Investigation of superfilling and electrical characteristics in low-impurity-incorporated Cu metallizationShieh, JM; Chang, SC; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2001Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copperChang, SC; Shieh, JM; Lin, KC; Dai, BT; Wang, TC; Chen, CF; Feng, MS; Li, YH; Lu, CP; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2002Investigations of pulse current electrodeposition for damascene copper metalsChang, SC; Shieh, JM; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
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