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顯示 1 到 9 筆資料，總共 9 筆
公開日期標題作者
1-十一月-200760 GHz broadband Ms-to-CPW hot-via flip chip interconnectsWu, Wei-Cheng; Hsu, Li-Han; Chang, Edward Yi; Kaernfelt, Camilla; Zirath, Herbert; Starski, J. Piotr; Wu, Yun-Chi; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-2007A delta-doped InGaP/InGaAs pHEMT with different doping profiles for device-linearity improvementLin, Yueh-Chin; Chang, Edward Yi; Yamaguchi, Hiroshi; Wu, Wei-Cheng; Chang, Chun-Yen; 電子工程學系及電子研究所; 友訊交大聯合研發中心; Department of Electronics Engineering and Institute of Electronics; D Link NCTU Joint Res Ctr
1-二月-2010Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging ApplicationsHsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wu, Yun-Chi; Wang, Chin-Te; Lee, Ching-Ting; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-八月-2010Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent ReliabilityHsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2009Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip InterconnectsWu, Wei-Cheng; Chang, Edward Yi; Hwang, Ruey-Bing; Hsu, Li-Han; Huang, Chen-Hua; Karnfelt, Camilla; Zirath, Herbert; 材料科學與工程學系; 電信工程研究所; Department of Materials Science and Engineering; Institute of Communications Engineering
1-三月-2012Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHzHsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin; 材料科學與工程學系; Department of Materials Science and Engineering
30-九月-2010High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereofChang, Edward-yi; Hsu, Li-Han; Oil, Chee-Way; Wu, Wei-Cheng; Wang, Chin-te
1-一月-2014Investigation of the Flip-Chip Package With BCB Underfill for W-Band ApplicationsWang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping; 材料科學與工程學系; Department of Materials Science and Engineering
29-十月-2009Vertical Transmission StructureChang, Edward Yi; Wu, Wei-Cheng; Hwang, Ruey-Bing; Hsu, Li-Han
顯示 1 到 9 筆資料，總共 9 筆