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公開日期標題作者
1-四月-2001Effect of temperature and illumination on the instability of a-Si : H thin-film transistors under AC gate bias stressHuang, CY; Teng, TH; Yang, CJ; Tseng, CH; Cheng, HC; 奈米中心; Nano Facility Center
1-十一月-2003Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallizationHsu, YC; Shao, TL; Yang, CJ; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
1-三月-1999Formation of silicided shallow p(+) n junctions by BF2+ implantation into thin amorphous-Si or Ni/amorphous-Si films on Si substrates and subsequent Ni silicidationJuang, MH; Hu, MC; Yang, CJ; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十二月-2001Generalized interconnect delay time and crosstalk models: I. Applications of interconnect optimization designLee, TGY; Tseng, TY; Wong, SC; Yang, CJ; Liang, MS; Cheng, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十二月-2001Generalized interconnect delay time and crosstalk models: II. Crosstalk-induced delay time deterioration and worst crosstalk modelsLee, TGY; Tseng, TY; Wong, SC; Yang, CJ; Liang, MS; Cheng, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-八月-2004Microstructure evolution during electromigration in eutectic SnPb solder bumpsLu, CM; Shao, TL; Yang, CJ; Chen, C; 材料科學與工程學系; Department of Materials Science and Engineering
1-六月-2005The performance of the number of vehicles in a dynamic connecting transport AMHSLin, JT; Wang, FK; Yang, CJ; 工業工程與管理學系; Department of Industrial Engineering and Management
10-五月-2006Trench gap-tilling copper by ion beam sputter depositionHan, S; Lee, TL; Yang, CJ; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
1-十月-2000Turnaround phenomenon of threshold voltage shifts in amorphous silicon thin film transistors under negative bias stressHuang, CY; Tsai, JW; Teng, TH; Yang, CJ; Cheng, HC; 奈米中心; Nano Facility Center
顯示 1 到 9 筆資料，總共 9 筆