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Evaluation of Monolithic 3-D Logic Circuits and 6T SRAMs With InGaAs-n/Ge-p Ultra-Thin-Body MOSFETs
(2016-03-01)
Yu, Kuan-Chin
;
Fan, Ming-Long
;
Su, Pin
;
Chuang, Ching-Te
;
電子工程學系及電子研究所
This paper evaluates monolithic 3-D logic circuits and 6T SRAMs composed of InGaAs-n/Ge-p ultra-thin-body MOSFETs while considering interlayer coupling through TCAD mixed-mode model. This paper indicates that monolithic 3-D InGaAs/Ge logic circuits provide equal leakage and better delay performance compared with planar 2-D structure through optimized 3-D layout. The monolithic 3-D InGaAs/Ge 6T SRAMs can simultaneously improve the cell stability and performance through optimized 3-D layout. We suggest two 3-D SRAM layout designs for high performance and low power applications, respectively. Moreover, with optimized 3-D layout designs, InGaAs/Ge logic circuits exhibit larger delay improvement, and the 6T SRAMs exhibit larger read access time and time-to-write improvement compared with Si counterparts.
Evaluation of Stability, Performance of Ultra-Low Voltage MOSFET, TFET, and Mixed TFET-MOSFET SRAM Cell With Write-Assist Circuits
(2014-12-01)
Chen, Yin-Nien
;
Fan, Ming-Long
;
Hu, Vita Pi-Ho
;
Su, Pin
;
Chuang, Ching-Te
In this work, we propose a mixed TFET-MOSFET 8T SRAM cell comprising MOSFET cross-coupled inverters, dedicated TFET read stack and TFET write access transistors for ultra-low voltage operation. Exploiting both the merits of TFET and MOSFET devices, the proposed SRAM cell provides significant improvement in SRAM stability, V-min and performance. The stability and performance of the proposed cell are evaluated and compared with the conventional MOSFET 8T cell and pure TFET 8T cell using mixed-mode TCAD simulations based on published design rules for 22 nm technology node. Besides, the impacts of the device design of the proposed SRAM cell on the stability are also investigated. Various write-assist techniques to enhance the write-ability across V-DD = 0.2 to 0.7 V for these SRAM cells are comparatively assessed. The results indicate that the proposed mixed TFET-MOSFET cell topology is viable for ultra-low voltage operation while MOSFET cell provides better stability and performance for high voltage operation.
A 40 nm 512 kb Cross-Point 8 T Pipeline SRAM With Binary Word-Line Boosting Control, Ripple Bit-Line and Adaptive Data-Aware Write-Assist
(2014-12-01)
Lien, Nan-Chun
;
Chu, Li-Wei
;
Chen, Chien-Hen
;
Yang, Hao-I.
;
Tu, Ming-Hsien
This paper presents a cross-point 512 kb 8 T pipeline static random-access memory (SRAM). The cross-point structure eliminates write half-select disturb to facilitate bit-interleaving architecture for enhanced soft error immunity. The design employs boosted word-line (WL) for improving both read performance and write-ability. A ripple bit-line (RiBL) structure provides 30%-44% read access performance improvement and 2x-3.5x variation immunity at 0.7 V compared with the conventional hierarchical bit-line (HiBL) schemes. An adaptive data-aware write-assist (ADAWA) with VCS tracking is employed to further enhance the write-ability while ensuring adequate stability for half-selected cells on the selected bit-lines. An adaptive voltage detector (AVD) with binary boosting control is used to mitigating gate electric over-stress. The design is implemented in UMC 40 nm low-power (40LP) CMOS technology. The 512 kb test chip operates from 1.5 V to 0.65 V, with maximum operation frequency of 800 MHz@1.1 V and 200 MHz@0.65 V. The measured power consumption is 0.5 mW/MHz (active) and 4.4 mW (standby) at 1.1 V, and 0.107 mW/MHz (active) and 0.367 mW (standby) at 0.65 V.
Evaluation of Sub-0.2 V High-Speed Low-Power Circuits Using Hetero-Channel MOSFET and Tunneling FET Devices
(2014-12-01)
Chen, Yin-Nien
;
Fan, Ming-Long
;
Hu, Vita Pi-Ho
;
Su, Pin
;
Chuang, Ching-Te
This paper investigates the feasibility of sub-0.2 V high-speed low-power circuits with hetero-channel MOSFET and emerging Tunneling FET (TFET) devices. First, the device designs and characteristics of hetero-channel MOSFET and TFET devices are discussed and compared. Due to the significant leakage current of ultra-low V-T hetero-channel MOSFET devices, assist-circuits are required for hetero-channel MOSFET-based circuits to operate at 0.2 V. Second, the delay, dynamic energy and the Standby power of hetero-channel TFET-based and MOSFET-based logic circuits including Inverter, NAND, BUS Driver, and Latch are analyzed and evaluated. The results indicate that hetero-channel TFET-based circuits with Dual Oxide (DOX) device design to reduce the Miller capacitance provide the potential to achieve high-speed low-power operation at V-DD = 0.2 V, while the use of assist-circuits in MOSFET-based design improves the delay and dynamic energy at the expense of increased device count, circuit area, and large Standby and sleep-mode leakage power. Finally, the impacts of temperature and process variations on TFET-based and MOSFET-based logic circuits are discussed.
2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications
(2014-12-01)
Huang, Po-Tsang
;
Wu, Shang-Lin
;
Huang, Yu-Chieh
;
Chou, Lei-Chun
;
Huang, Teng-Chieh
Heterogeneously integrated and miniaturized neural sensing microsystems are crucial for brain function investigation. In this paper, a 2.5D heterogeneously integrated bio-sensing microsystem with mu-probes and embedded through-silicon-via (TSVs) is presented for high-density neural sensing applications. This microsystem is composed of mu-probes with embedded TSVs, 4 dies and a silicon interposer. For capturing 16-channel neural signals, a 24 x 24 mu-probe array with embedded TSVs is fabricated on a 5 x 5 mm2 chip and bonded on the back side of the interposer. Thus, each channel contains 6 x 6 mu-probes with embedded TSVs. Additionally, the 4 dies are bonded on the front side of the interposer and designed for biopotential acquisition, feature extraction and classification via low-power analog front-end (AFE) circuits, area-power-efficient analog-to-digital converters (ADCs), configurable discrete wavelet transforms (DWTs), filters, and a MCU. An on-interposer bus (mu-SPI) is designed for transferring data on the interposer. Finally, the successful in-vivo test demonstrated the proposed 2.5D heterogeneously integrated bio-sensing microsystem. The overall power of this microsystem is only 676.3 mu W for 16-channel neural sensing.
An on-chip test structure and digital measurement method for statistical characterization of local random variability in a process
(2008-09-01)
Mukhopadhyay, Saibal
;
Kim, Keunwoo
;
Jenkins, Keith A.
;
Chuang, Ching-Te
;
Roy, Kaushik
This paper presents an on-chip characterization method for random variation in minimum sized devices in nanometer technologies, using a sense amplifier-based test circuit. Instead of analog current measurements required in conventional techniques, the presented circuit operates using digital voltage measurements. Simulations of the test structure using predictive 70 nm and hardware based 0.13 mu m CMOS technologies show good accuracy (error similar to 5%-10%) in the prediction of random variation even in the presence of systematic variations. A test chip is fabricated in 0.13 mu m bulk CMOS technology and measured to demonstrate the operation of the test structure.
Impacts of gate-oxide breakdown on power-gated SRAM
(2011-01-01)
Yang, Hao-I
;
Hwang, Wei
;
Chuang, Ching-Te
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
This paper presents a detailed analysis on the impacts of various gate-oxide breakdown (BD) paths in column-based header- and footer-gated SRAMs. It is shown that with gate-oxide BD, the read static noise margin (RSNM) and write margin (WM) degrade in general. Pass-transistor gate-oxide BD between WL and BL is shown to degrade read/write margin and performance, and to affect other healthy cells along the same column as well. The effects of gate-to-source BD of cell transistors are shown to confine to the individual cells, while multiple cells suffering cell transistor drain-to-drain BD in a column could cumulatively affect VVDD (header structure) or VVSS (footer structure), thus influencing other cells in the same column. In particular, we show that the gate-oxide BD of the power-switches has severe and even detrimental effects on the margin, stability, and performance of the SRAM array. Several techniques to mitigate the power-switch gate-oxide BD have been evaluated, including adding a gate series resistance to the power-switch, dual threshold voltage power-switch, thick gate-oxide power-switch, and dual gate-oxide thickness (dual-T(OX)) power-switch. It is shown that the dual-Tox power-switch improves the time-to-dielectric-breakdown (7(BD)) of the power-switch while maintaining the performance without side effect. (C) 2010 Elsevier Ltd. All rights reserved.
40 nm Bit-Interleaving 12T Subthreshold SRAM With Data-Aware Write-Assist
(2014-09-01)
Chiu, Yi-Wei
;
Hu, Yu-Hao
;
Tu, Ming-Hsien
;
Zhao, Jun-Kai
;
Chu, Yuan-Hua
This paper presents a new bit-interleaving 12T sub-threshold SRAM cell with Data-Aware Power-Cutoff (DAPC) Write-assist to improve the Write-ability to mitigate increased device variations at low supply voltage under deep sub-100 nm processes. The disturb-free feature facilitates the bit-interleaving architecture that can reduce multiple-bit errors in a single word and enhance soft error immunity by employing error checking and correction (ECC) techniques. The proposed 12T SRAM cell is demonstrated by a 4 kb SRAM macro implemented in 40 nm general purpose (40GP) CMOS technology. The test chip operates from typical V-DD to 350 mV (similar to 100 mV lower than the threshold voltage) with V-DDMIN limited by Read operation. Data can be written successfully for V-DD down to 300 mV. The measured maximum operation frequency is 11.5 MHz with total power consumption of 22 mu W at 350 mV, 25 degrees C.
Single-trap-induced random telegraph noise for FinFET, Si/Ge Nanowire FET, Tunnel FET, SRAM and logic circuits
(2014-04-01)
Fan, Ming-Long
;
Yang, Shao-Yu
;
Hu, Vita Pi-Ho
;
Chen, Yin-Nien
;
Su, Pin
In this paper, we comprehensively review the impacts of single-trap-induced random telegraph noise (RTN) on FinFET, Ge/Si Nanowire FET and Tunnel FET (TFET). The resulting influences on the thermionic-based current conduction such as FinFET, Si-NW FET and Ge-NW FET (at low drain bias) as well as interband tunneling dominated current conduction such as TFET and high-drain-biased Ge-NW FET are extensively addressed in device and circuit level. The location of the trap is shown to have profound impacts and the impacts vary with bias conditions and trap types. The worst-case analysis of the stability/performance and leakage/delay for all possible trapping/detrapping RTN combinations are investigated for FinFET, Si-/Ge-NW FETs and TFET based 6T/8T SRAM cells and logic circuits. (C) 2014 Elsevier Ltd. All rights reserved.
Low-Power Multiport SRAM With Cross-Point Write Word-Lines, Shared Write Bit-Lines, and Shared Write Row-Access Transistors
(2014-03-01)
Wang, Dao-Ping
;
Lin, Hon-Jarn
;
Chuang, Ching-Te
;
Hwang, Wei
;
電子工程學系及電子研究所
This brief proposes one-write-one-read (1W1R) and two-write-two-read (2W2R) multiport (MP) SRAMs for register file applications in nanoscale CMOS technology. The cell features a cross-point Write word-line structure to mitigate Write Half-Select disturb and improve the static noise margin (SNM). The Write bit-lines (WBLs) and Write row-access transistors are shared with adjacent bit-cells to reduce the cell transistor count and area. The scheme halves the number of WBL, thus reducing WBL leakage and power consumption. In addition, column-based virtual VSS control is employed for the Read stack to reduce the Read power consumption. Post-sim results show that the proposed scheme reduces both Write/Read current consumption by over 30% compared with the previous MP structure. The proposed scheme is demonstrated and validated by an 8-Kb 2W2R SRAM test chip fabricated in TSMC 40-nm CMOS technology.

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