Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 陳宏明 | en_US |
| dc.contributor.author | Chen Hung-Ming | en_US |
| dc.date.accessioned | 2014-12-13T10:45:00Z | - |
| dc.date.available | 2014-12-13T10:45:00Z | - |
| dc.date.issued | 2010 | en_US |
| dc.identifier.govdoc | NSC99-2220-E009-038 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/100229 | - |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=2159570&docId=347578 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 三維度積體電路 | zh_TW |
| dc.subject | 封裝設計 | zh_TW |
| dc.subject | flip-chip繞線 | zh_TW |
| dc.title | 針對3D整合之電子設計自動化技術開發---子計畫四：立體堆疊晶片與系統級構裝之設計最佳化研究(II) | zh_TW |
| dc.title | 3D-SiC and 3D-SiP Design Planning (II) | en_US |
| dc.type | Plan | en_US |
| dc.contributor.department | 國立交通大學電子工程學系及電子研究所 | zh_TW |
| Appears in Collections: | Research Plans | |
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