智慧型仿生系統之晶片系統平台技術開發---子計畫一：三維電極感測陣列之研發(III)

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DC Field	Value	Language
dc.contributor.author	邱俊誠	en_US
dc.contributor.author	CHIOU JIN-CHERN	en_US
dc.date.accessioned	2014-12-13T10:45:02Z	-
dc.date.available	2014-12-13T10:45:02Z	-
dc.date.issued	2010	en_US
dc.identifier.govdoc	NSC99-2220-E009-019	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/100249	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=2159102&docId=347483	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	微機電技術	zh_TW
dc.subject	微組裝	zh_TW
dc.subject	電極	zh_TW
dc.subject	三維	zh_TW
dc.subject	植入式系統	zh_TW
dc.subject	microassembly	en_US
dc.subject	microprobe array	en_US
dc.subject	three dimensional probe array	en_US
dc.title	智慧型仿生系統之晶片系統平台技術開發---子計畫一：三維電極感測陣列之研發(III)	zh_TW
dc.title	The Development of Three-Dimensional Recording Microelectrode Arrays (III)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電機與控制工程學系（所）	zh_TW
Appears in Collections:	Research Plans

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