三維積體電路(3D IC)關鍵技術之研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	陳冠能	en_US
dc.contributor.author	CHEN KUAN-NENG	en_US
dc.date.accessioned	2014-12-13T10:45:18Z	-
dc.date.available	2014-12-13T10:45:18Z	-
dc.date.issued	2010	en_US
dc.identifier.govdoc	NSC98-2218-E009-013-MY2	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/100326	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=2012399&docId=329400	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	三維積體電路(3D IC)關鍵技術之研究	zh_TW
dc.title	Research and Development of Key Technologies for 3D IC	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電子工程學系及電子研究所	zh_TW
Appears in Collections:	Research Plans