針對3D整合之電子設計自動化技術開發---子計畫一：三維度積體電路的隨機電熱模擬及其對功率最佳化的應用(II)

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DC Field	Value	Language
dc.contributor.author	李育民	en_US
dc.contributor.author	LEE YU-MIN	en_US
dc.date.accessioned	2014-12-13T10:45:59Z	-
dc.date.available	2014-12-13T10:45:59Z	-
dc.date.issued	2010	en_US
dc.identifier.govdoc	NSC99-2220-E009-035	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/100536	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=2157908&docId=347238	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	三維度積體電路	zh_TW
dc.subject	電熱模擬	zh_TW
dc.subject	功率最佳化	zh_TW
dc.subject	低功率設計	zh_TW
dc.subject	多重電壓設計	zh_TW
dc.subject	3-D IC	en_US
dc.subject	Electro-Thermal Analysis	en_US
dc.subject	Power Optimization	en_US
dc.subject	Low Power Design	en_US
dc.subject	Multiple Supply Voltage Design	en_US
dc.title	針對3D整合之電子設計自動化技術開發---子計畫一：三維度積體電路的隨機電熱模擬及其對功率最佳化的應用(II)	zh_TW
dc.title	Stochastic Electro-Thermal Simulation for 3-D ICs and Its Application to 3-D IC Power Optimization (II)	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電信工程學系（所）	zh_TW
Appears in Collections:	Research Plans

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