完整後設資料紀錄
DC 欄位語言
dc.contributor.authorWang, Xin Pengen_US
dc.contributor.authorLim, Andy Eu-Jinen_US
dc.contributor.authorYu, Hong Yuen_US
dc.contributor.authorLi, Ming-Fuen_US
dc.contributor.authorRen, Chien_US
dc.contributor.authorLoh, WeiYipen_US
dc.contributor.authorZhu, Chun Xiangen_US
dc.contributor.authorChin, Alberten_US
dc.contributor.authorTrigg, Alastair Daviden_US
dc.contributor.authorYeo, Yee-Chiaen_US
dc.contributor.authorBiesemans, Sergeen_US
dc.contributor.authorLo, Guo-Qiangen_US
dc.contributor.authorKwong, Dim-Leeen_US
dc.date.accessioned2014-12-08T15:13:09Z-
dc.date.available2014-12-08T15:13:09Z-
dc.date.issued2007-11-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2007.907130en_US
dc.identifier.urihttp://hdl.handle.net/11536/10143-
dc.description.abstractA lanthanum (La)-doped HfN is investigated as an n-type metal gate electrode on SiO(2) with tunable work function. The variation of La concentration in (Hf(x)La(1-x))N(y) modulates the gate work function from 4.6 to 3.9 eV and remains stable after high-temperature annealing (900 degrees C to 1000 degrees C, which makes it suitable for n-channel MOSFET application. An ultrathin high-k dielectric layer was formed at the metal/SiO(2) interface due to the (Hf(x)La(1-x))N(y) and SiO(2) interaction during annealing. This causes a slight reduction in the effective oxide thickness and improves the tunneling current of the gate dielectric by two to three orders. We also report the tunability of TaN with Al doping, which is suitable for a p-type metal gate work function. Based on our results, several dual-gate integration processes by incorporating lanthanum or aluminum into a refractory metal nitride for CMOS technology are proposed.en_US
dc.language.isoen_USen_US
dc.subjecthigh-kappa gate dielectricen_US
dc.subjectmetal gateen_US
dc.subjectMOSFETen_US
dc.subjectwork function tuningen_US
dc.subject(Hf(x)La(1-x))N(y)en_US
dc.subject(ThAl(1-x))N(y)en_US
dc.titleWork function tunability of refractory metal nitrides by lanthanum or aluminum doping for advanced CMOS devicesen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2007.907130en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume54en_US
dc.citation.issue11en_US
dc.citation.spage2871en_US
dc.citation.epage2877en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000250590200009-
dc.citation.woscount7-
顯示於類別:期刊論文


文件中的檔案:

  1. 000250590200009.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。