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dc.contributor.author李育民en_US
dc.contributor.authorLEE YU-MINen_US
dc.date.accessioned2014-12-13T10:51:52Z-
dc.date.available2014-12-13T10:51:52Z-
dc.date.issued2007en_US
dc.identifier.govdocNSC96-2220-E009-012zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/102954-
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=1462772&docId=262096en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.language.isozh_TWen_US
dc.title單晶片系統驗證之核心技術開發---子計畫六:針對先進晶片設計的熱點驗證之完整熱模型與高效能熱分析(III)zh_TW
dc.titleCompact Thermal Modeling and Efficient Thermal Simulation for Hot Spots Verifications of Modern IC Designs(III)en_US
dc.typePlanen_US
dc.contributor.department國立交通大學電信工程學系(所)zh_TW
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