標題: Comprehensive Examination of Threshold Voltage Fluctuations in Nanoscale Planar MOSFET and Bulk FinFET Devices
作者: Hwang, Chih-Hong
Cheng, Hui-Wen
Yeh, Ta-Ching
Li, Tien-Yeh
Huang, Hsuan-Ming
Li, Yiming
電信工程研究所
Institute of Communications Engineering
關鍵字: Threshold voltage fluctuation;random dopant;process-variation;gate-length deviation;line-edge roughness;modeling and simulation
公開日期: 2008
摘要: Intrinsic fluctuations on device characteristics, such as the threshold voltage (V(th)) fluctuation is crucial in determining the behavior of nanoscale semiconductor devices. In this paper, the dependency of process-variation and random-dopant-induced Vth fluctuation on the gate oxide thickness scaling in 16 nm metal-oxide-semiconductor field effect transistors (MOSFETs) is investigated. Fluctuations of the threshold voltage for the studied planar MOSFETs with equivalent oxide thicknesses (EOT) from 1.2 nm to 0.2 nm (e.g., SiO(2) for the 1.2 and 0.8 nm EOTs, Al(2)O(3) for the 0.4 nm EOT and HfO(2) for the 0.2 nm EOT) are then for the first time compared with the results of 16nm bulk fin-typed filed effect transistors (FinFETs), which is one of the promising candidates for next generation semiconductor devices. An experimentally validated simulation is conducted to investigate the fluctuation property. Result of this study confirms the suppression of Vth fluctuations with the gate oxide thickness scaling (using high-kappa dielectric). It's found that the immunity of the planar MOSFET against fluctuation suffers from nature of structural limitations. Bulk FinFETs alleviate the challenges of device's scaling and have potential in the nanoelectronics application.
URI: http://hdl.handle.net/11536/1030
ISBN: 978-1-4200-8505-1
期刊: NSTI NANOTECH 2008, VOL 3, TECHNICAL PROCEEDINGS
起始頁: 647
結束頁: 650
Appears in Collections:Conferences Paper