三維積體電路

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DC Field	Value	Language
dc.contributor.author	陳冠能	en_US
dc.contributor.author	李世偉	en_US
dc.date.accessioned	2014-12-16T06:11:58Z	-
dc.date.available	2014-12-16T06:11:58Z	-
dc.date.issued	2013-03-16	en_US
dc.identifier.govdoc	H01L025/04	zh_TW
dc.identifier.govdoc	H01L023/52	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/103304	-
dc.description.abstract	一種三維積體電路,其包括一第一晶圓及一第二晶圓。第一晶圓包括一第一導電圖樣。第二晶圓包括一第二導電圖樣,且電性連接第一導電圖樣。其中第一晶圓與第二晶圓的位移量係根據第一導電圖樣及第二導電圖樣的電阻値來決定。	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	三維積體電路	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	TWN	zh_TW
dc.citation.patentnumber	201312724	zh_TW
Appears in Collections:	Patents

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